Abstract: A high temperature superconductor (HTS) synchronous motor or generator includes permanent magnets disposed in the rotor. The permanent magnets can be magnetized after the rotor assembly is manufactured. The permanent magnets reduce flux density perpendicular to the superconducting coil. The magnets can be disposed in the d-axis of the motor. The motor is particularly useful in propulsion applications.

Abstract: A bridge structure is utilized on a circuit board. The bridge structure includes a first element, a second element and a gap between the first element and a second element. Soder paste is capable of flowing when the circuit board is heated, such that the paste on the first element comes into contact with paste on the second element. The paste solidifies when cooled such that solidified paste serves to connect the first element and the second element. The first and second elements can be L-shaped.

Abstract: A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs.

Abstract: A motor control system or electronic motor starter is optimized to replace electromechanical motor starters. Heat dissipation requirements are reduced by utilizing a by-pass contactor when the motor is in a run mode. The electronic motor starter derives power from an AC motor control signal conventionally utilized to power the coritactor coil associated with a conventional electromechanical starter.

Abstract: A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.

Abstract: A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.

Abstract: A bidirectional lateral insulated gate bipolar transistor (IGBT) includes two gate electrodes. The IGBT can conduct current in two directions. The IGBT relies on a double RESURF structure to provide high voltage blocking in both directions. The IGBT is symmetrical, having an N-type drift region in contact with an oxide layer. A P-type region is provided above the N-type drift region, having a portion more heavily doped with P-type dopants. The double RESURF structure can be provided by a buried oxide layer, a floating doped region, or a horizontal PN junction. The IGBT can be utilized in various power operations, including a matrix switch or a voltage source converter.

Abstract: A power application circuit utilizes microelectromechanical (MEM) switches to reduce power loss in energy conversion equipment. The MEM switches can be integrated on a single substrate with a diode or semiconductor switch. The MEM switches can be included in a single circuit package with another semiconductor device and may include a control circuit which turns each MEM switch on or off. The MEM switch is controlled so that it is opened and closed only when a relatively low voltage drop occurs across the switch. The MEM switch can be utilized in AC to AC converters, DC to AC converters, AC to DC converters, matrix converters, motor controllers, resonant motor controllers, or other power application devices. The MEM switch can also be included in a single package with an IGBT which is optimized for low-switching losses. It can be included in a single package with a diode to reduce conduction loss in power diode bridges.

Abstract: A multilayer circuit board system or laminated circuit board system for use in a motor controller includes at least two motherboards, at least one power substrate circuit board, and a capacitor circuit board. The circuit boards are mounted in an aperture or trench within each mother board. The power substrate module circuit board includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit boards are interconnected without the use of external connectors or wires. The use of two mother boards increases the rigidity of the circuit board system.

Abstract: A matrix converter utilizes a bidirectional lateral insulated gate bipolar transistor (IGBT) including two gate electrodes. The IGBT can conduct in two directions. The matrix converter preferably is a three phase matrix converter including nine bidirectional IGBT switches. The IGBT switches are controlled by a control circuit which includes eighteen control lines, two for each IGBT. Additionally, the bidirectional IGBT can be used in a precharge circuit of a power inverter or in a dynamic brake associated with a motor controller.

Abstract: A power substrate module having a multilayer circuit board or laminated circuit board for use in a motor controller is described. The power substrate module includes pair of switching devices coupled across a direct current bus for converting direct current power from the bus to controlled alternating current power in response to control signals. The circuit board includes a first conductive layer, a second conductive layer and an insulative layer separating the conductive layers. The first and second conductive layers each include a conductive bus region, one of which is coupled to the first switching device and forms a high side of the direct current bus, and the other of which is coupled to the second switching device and forms the low side of the direct current bus.

Abstract: A structural key is checked under program control to control the mode of operation for a processor-based electronic circuit board. A break-away key portion of the circuit board is connected to the main portion along a boundary of frangible links with circuit paths traversing the boundary and carrying logic signals. The presence or absence of the break-away portion is sensed by sensing the bit pattern at an I/O address. If the absence of the break-away portion is sensed, the function of a user-commanded motion block is tested and processor operation is limited to executing functions for the mode corresponding to the absence of the break-away portion.

Abstract: A bidirectional lateral insulated gate bipolar transistor (IGBT) includes two gate electrodes. The IGBT can conduct current in two directions. The IGBT relies on a RESURF operation to provide high voltage blocking in both directions. The IGBT is symmetrical, having N-type drift region in contact with an oxide layer. A P-type region is provided above the N-type-drift region, having a portion more heavily doped with P-type dopants. The RESURF operation can be provided by a buried oxide layer or by a P substrate or by a horizontal PN junction. The IGBT can be utilized in various power operations, including a matrix switch or a voltage source converter.

Abstract: A mounting for a solderable component module (SCM.TM.) interconnect module includes an elongated trench or blind via for receiving an edge of the module. The module may be a circuit board or other electrical device and preferably includes edge finger connectors. The elongated trench preferably includes hemicylinders located about the periphery. The hemicylinders provide plated through conductors for connecting to the finger connectors of the module. The trench is made according to an advantageous method in which the aperture is etched in order to remove barbs or extra copper material caused by milling the aperture. Preferably, the module fits into the trench with an interference or size-on-size fit. The trench may include strain relief areas. Additionally, the mounting can include apertures for receiving legs on the mounted board.

Abstract: A device and method establishing an electrically conductive path between a pair of contacts in low voltage, low current applications, such as in electronic circuits. The device and method feature a flexible spanner that contacts a pair of fixed contacts with a sweeping movement. The spanner includes a bent portion that flexes when a force is exerted on the spanner such that a contact portion of the spanner sweeps across the surface of the pair of fixed contacts.

Abstract: A bar code reader and the mirror oscillating system thereof are disclosed herein. The bar code reader is of the type which produces a scanning light beam by oscillating one mirror with a electromagnetic oscillator and a raster scanning device. The raster scanning device includes a non-contact sensor which produces a position signal. The position signal is representative of the location of the raster mirror. The position signal is utilized to adjust the motor drive signal which positions the raster scanning device. The position signal allows the motor a low cost sheet metal stepper motor to be positioned more accurately despite performance degradation over the life of the motor.

Abstract: A selector switch includes a knob, a bezel and a retaining clip. The retaining clip is mounted on the knob and secures the knob to the bezel. The retaining clip is C-shaped and has a tab centrally disposed on the retaining clip. When the tab is pressed by a tool, the retaining clip contracts and the knob may be detached from the bezel. The tab can be accessed through a slot between the bezel and the knob by a screwdriver. The knob, bezel and retaining clip can be made of plastic.

Abstract: A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs.

Abstract: A multilayer circuit board system or laminated circuit board system for use in a motor controller includes a motherboard, at least one power substrate circuit board, and a capacitor circuit board. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit board are interconnected without the use of external connectors or wires. A flexible circuit board layer or SCM.TM. interconnect interface allows the circuit boards to be connected solely by printed circuit (PC) wires.

Abstract: A solder resist pattern for a single in-line package (SIP) finger connector, or other interface member includes small solder resist features spaced closely together. The features can be circular, square, diamond-shaped, star-shaped, or other geometry and preferably are placed on finger connectors in a photo-imaging process. The pattern includes meniscus channels which are narrow enough to prevent solder from adhering to the finger connectors. The surface area of the features is small enough so that the pattern can be easily removed by a low impact or non-contact operation. Preferably, the pattern is removed by a hot air solder knife after the board is subjected to a solder wave.