Abstract: Resist is applied to a surface with a syringe, or other suitable dropper, equipped with a millipore filter to remove contaminants. The surface is completely flooded with resist. Resist is allowed to remain on the surface of the evaporated metal for a period of time prior to spin coating. Allowing resist to remain on the surface prior to coating produces a uniform film. For a 2 micron thick uniform resist coating, a minimum of 15 seconds is allowed prior to spinning while in the case of a 4 micron thick resist coating a much longer period is allowed.For the application of a 2 micron film, the resist material after partial drying for approximately 15 seconds is spun at 2000 rpm for 30 seconds. In order to apply a 5 micron thick resist film, resist is spun at 2000 rpm for 30 seconds after partial drying for approximately 10 minutes.

Abstract: A method is disclosed for the fabrication of a gaseous discharge display and/or memory device which provides a predetermined uniform gap between the inner walls of the gaseous discharge device without the use of spacer elements. Sealing about the panel periphery is provided by a devitrifiable seal glass, the viscosity of which is closely controlled as a function of time and temperature. The glass sealant, preferably in rod form, is extruded by mixing glass frit with a solvent-binder system to form a viscous slurry, extruding this slurry into rod form and thereafter sintering the rods in an oven under conditions whereby the glass sealant softens but does not reflow. The devitrifiable glass during the subsequent sealing process reflows and then crystallizes, and the viscous flow varies inversely as the crystallization.