Abstract: A method for making a titanium carbide layer is described. That method comprises alternately introducing a carbon containing precursor and a titanium containing precursor into a chemical vapor deposition reactor, while a substrate is maintained at a selected temperature. The reactor is operated for a sufficient time, and pulse times are selected for the carbon containing precursor and the titanium containing precursor, to form a titanium carbide layer of a desired thickness and workfunction on the substrate.
Type:
Grant
Filed:
December 7, 2004
Date of Patent:
June 20, 2006
Assignee:
Intel Corporation
Inventors:
Matthew V. Metz, Suman Datta, Mark L. Doczy, Jack Kavalieros, Justin K. Brask, Robert S. Chau