Abstract: A device for removing leads (14) of a circuit module (12) from sockets (16) mounted in a circuit board (18) includes a first assembly (51, 52 and 54) having two depending arrays of fingers which engage the socket (16) and a second assembly (34) having two arrays of pivotally mounted jaws (31 and 32) which are manipulated to grip opposite sides of the circuit module. The second assembly is movably mounted within the first assembly, and when moved upwardly away from the circuit board, acts to pull the circuit module to extract the leads from the sockets while the fingers hold the sockets from dislodgement from the board. The fingers are longitudinally grooved (61) to guide the leads during extraction from the sockets.

Abstract: An apparatus (10) and methods are disclosed for preparing the terminated end of a flat cable (25) for connectorization wherein the cable is of the type having two arrays of overlying/underlying conductors (27, 28) separated by an insulative center film (31), with each array being bonded directly to only the respectively adjacent one of two mutually disposed outer insulative films (33, 34), and wherein an aligned pair of isolating members (36, 37) are respectively positioned between, and transversely of, a different side of the center film the associated array of conductors at each predetermined terminating end of the cable, as fabricated. The apparatus includes a cross-slide assembly (12, 41), a flare-out die mechanism (14, 97), an optional trimming die mechanism (16, 134, 136) and a fold-back roller mechanism (18, 151, 167, 168).

Abstract: Several flat cable embodiments (10, 10', 10", 10'", 10"") are disclosed, as are methods and apparatus (30) for the selective manufacture and connectorization of same. In accordance with one preferred flat cable embodiment (10), adapted for telephone under carpet applications, two precisely offset arrays of rectangularly shaped conductors (13, 14) are separated by a center film (16), with each array being adhesively bonded through an associated adhesive coating (21 or 22) to only the respectively adjacent one of two outer films (18 or 19).

Abstract: Several CRT monitor assemblies, (10, 10', 10", 40, 60, 120, 170, 190), each of which incorporates a specially constructed de-ionized air generating system (12, 12', 12", 45, 70, 130, 175, 175') are adapted to produce a laminar-type flow of de-ionized air, in a predetermined direction, across the screen (26, 26', 26", 42a, 66a-69a, 126a-129a, 171a, 172a, 171a', 172a') of one or more monitors (11, 42, 66-69, 126-129, 171, 172) so as to prevent the build-up of detrimental static charge on the screens.

Abstract: Several flat cable embodiments (10, 10', 10", 10'", 10"") are disclosed, as are methods and apparatus (30) for the selective manufacture and connectorization of same. In accordance with one preferred flat cable embodiment (10), adapted for telephone under carpet applications, two precisely offset arrays of rectangularly shaped conductors (13, 14) are separated by a center film (16), with each array being adhesively bonded through an associated adhesive coating (21 or 22) to only the respectively adjacent one of two outer films (18 or 19).

Abstract: Several flat cable embodiments (10, 10', 10", 10'", 10"") are disclosed, as are methods and apparatus (30) for the selective manufacture and connectorization of same. In accordance with one preferred flat cable embodiment (10), adapted for telephone under carpet applications, two precisely offset arrays of rectangularly shaped conductors (13, 14) are separated by a center film (16), with each array being adhesively bonded through an associated adhesive coating (21 or 22) to only the respectively adjacent one of two outer films (18 or 19).

Abstract: Several flat cable assembly embodiments (10, 30, 60) are disclosed, as are methods for terminating and connectorizing the terminating ends of ribbon-shaped conductors (13, 33, 34, 63) arranged in at least one laterally disposed array in a flat cable (12, 32, 62). In accordance with all of the flat cable assembly embodiments, terminated insulation-stripped conductor end portions (13a', 33a', 34a', 63a') are twisted angularly a predetermined number of degrees from their initial orientation, as originally confined within the cable, prior to being secured to respectively associated connector mating elements of either the solder type (19, 44), or solderless type (64).

Abstract: A two-piece strain relief member (15), and a flat cable-strain relief member-connector assembly (10) are disclosed, wherein the member (15) is comprised of two complementary sections (15a, 15b) molded out of plastic material. Each member section is formed with first and second elongated planar wall portions (31a, b or 32a, b), with the second wall portion being oriented at an angle relative to the associated first wall portion, and terminating in a laterally disposed, cable-contacting rearward edge portion (31c or 32c). Each member section is also formed with an outwardly extending integral pin (36 or 37) and an outwardly tapered locking detent (41 or 42) respectively located near, and as a portion of, one end wall (31d or 32d), and with a pin-receiving bore (57 or 58) and a U-shaped locking latch (62 or 63) respectively located near, and as a portion of, the opposite end wall (47a or 48 a).

Abstract: A taping apparatus (10) is disclosed for applying a spaced array of transversely oriented material strips, such as in the form of plastic tapes (36), on each side of indexably advanced strip stock, such as in the form of a thin plastic film (12), during each dwell period of the latter, with corresponding tapes on opposite sides of the film being precisely aligned in pairs. The apparatus includes a film advancing assembly (13, 14, 16, 22, 24, 32), two mutually disposed tape applicator mechanisms (28, 29), a specially constructed platen assembly (26), mounted on a longitudinally disposed U-shaped support bed (27), and a control circuit (33). In order to provide the necessary solid backing for each of the tape applicator mechanisms (28, 29) when sequentially actuated, the platen assembly (26) includes a platen (90) formed with two longitudinally offset segments (91, 92) positioned at different elevations so as to define a film-receiving passageway (94) therebetween.

Abstract: Several flat cable embodiments (10, 10',10",10"',10"") are disclosed, as are methods and apparatus (30) for the selective manufacture and connectorization of same. In accordance with one preferred flat cable embodiment (10), adapted for telephone under carpet applications, two precisely offset arrays of rectangularly shaped conductors (13, 14) are separated by a center film (16), with each array being adhesively bonded through an associated adhesive coating (21 or 22) to only the respectively adjacent one of two outer films (18 or 19).

Abstract: A flat cable assembly embodiment (10) is disclosed, as are two terminated cable embodiments (12,12') and methods for terminating and connectorizing same, when the cable is of the type wherein two overlying/underlying arrays of laterally disposed conductors (13, 14, 13', 14') are respectively laminated between a common insulative center film (16, 16'), and an associated one of two opposite side outer insulative films (18, 19, 18', 19'), with a plurality of isolating strips (23, 24, 23', 24') interposed between, and adapted to adhere selectively to, the center film and an associated one of the two arrays of conductors. The isolating strips are positioned transversely across the center film in aligned pairs at each of a succession of predetermined terminating sites (e.g., at 5, 10 or 15 ft. intervals) along the cable, as fabricated.

Abstract: Several planar configured, metallized resistor embodiments (25, 35, 45, 55, 65) are disclosed, as are several methods of manufacturing and resistance trimming the same, particularly to values of resistance lower than the "as fabricated" nominal value thereof. In accordance with one preferred resistor embodiment (25), a plurality of associated discrete conductive bonding pads (29) are formed on a common supporting substrate (27), with each pad being in conductive contact with a different spaced site along the body portion (25a) of the resistor between the terminating ends thereof. The bonding pads (29) are advantageously adapted to allow bonded wire connections to be made between different selected pairs thereof, after fabrication of the resistor, whenever necessary to incrementally reduce the initial nominal value of resistance of the resistor to a lower desired value.

Abstract: Several tubular wire-retaining anchor embodiments (10, 10') are disclosed, as are several methods of manufacturing and securing the same to a supporting substrate, such as a circuit board (24). In accordance with one preferred embodiment (10), the tubular anchor is either molded out of suitable plastic material, or preferably formed as a short, severed cylindrical segment of an elongated section of plastic tubing (12). As needed, the anchors (10) are positioned in a desired spaced array on the circuit board (24) and adhesively bonded thereto. This is most readily accomplished by positioning each anchor (10) on a different droplet (28b), preferably comprising the second part of a two-part adhesive or cement (28), with the first part activator (28b) being pre-coated on at least a portion of the outer surface of the anchor.

Abstract: Several methods and apparatus (10, 60) are disclosed for vapor condensation heating only a selected underside surface area of an article (18, 18') while continuously minimizing loss of the generated vapor (26b, 26b') to the atmosphere. In accordance with several preferred embodiments, a composite vessel (11, 11') is formed with a lower stationary sidewall section (14), including venting means (28, 29, 31, 32, 34), and a channel (41) adapted to telescopically receive an upper, internally cooled and retractable sidewall section (13, 44, 13', 44') in a manner that establishes a vapor barrier (27) of controllable volume therewithin. As such, an article (18, 18') to be heated, when initially mounted on the top of the upper sidewall section (13, 13') may thereafter be readily displaced downwardly such that only a selected underside surface area thereof is controllably brought into contact with, and heated by, a single heat transfer liquid (26)--generated body of hot vapor (26b, 26b') confined therebelow.

Abstract: A floatable magnetic filter screen (10, 40, 52, 60) for removing metallic debris from work-functioning baths (26, 26') comprises a tubular rectangular outer frame (11, 11', 14, 14', 16, 61) that supports a plurality of magnet-forming webs (18, 18', 62), in a predetermined array, within the central opening thereof. The magnets (23, 23', 64) of each web, when required, are encapsulated within a protective material covering (e.g., 19, 19') so as to physically isolate them from a given bath (26, 26') within which the filter screen (10, 40, 52, 60) is to be employed. While the filter screen is adapted to normally float on the surface of a given bath, through piece part (33, 33', 53) initiated immersion of the filter screen in the bath, preferably using a piece part-carrying basket (36, 36', 51), the bath solution is effectively forced through the filter screen during both the downward and subsequent upward displacement of the latter.

Abstract: Through the use of a uniquely constructed molybdenum frame, a completely additive fabrication method may advantageously be employed to form an array of minute interconnecting circuit crossovers directly on the frame, using photolithographic and plating processes, with the requisite arches of the crossovers being directly formed within specially configured grooves of the frame during the plating operation. The frame is thereafter initially used as a temporary crossover carrier member, and subsequently as a bonding member during the thermo-compression bonding of the individual crossovers to respectively associated bond sites of the circuit, which typically may be of the integrated thin or thick film type. Such a simplified additive crossover generating technique advantageously obviates the need of not only potentially circuit-damaging chemical etching operations, but the many associated processing and handling steps associated therewith.

Abstract: This disclosure is directed to the vapor condensation heating of articles to an elevated temperature so as to perform, for example, a soldering, brazing or fusing operation thereon, without requiring the immersion of the articles within the heat transfer liquid-generated body of hot saturated vapor. This is accomplished in accordance with several methods and apparatus which allow the saturated body of vapor to controllably rise to and heat only a selected underside surface area (or areas) of each article, in succession, while minimizing the loss of any vapor to the atmosphere at all times.

Abstract: Several wire wrapping device embodiments are disclosed, each of which incorporates a releasable bit-locking mechanism associated with the bit-sleeve assembly thereof. The locking mechanism is mounted on the stationary sleeve of the device, and is actuated to responsively effect the release of the bit for rotation, prior to each successive wire wrap operation, only upon a terminal to be wire wrapped being inserted to a predetermined, but adjustable, depth within a terminal-receiving recess formed in the forward end of the bit. Such a mode of operation insures that each wire wrap is accurately positioned on each successive terminal. The bit-locking mechanism also may be optionally employed to responsively actuate an associated switch to either directly, or conditionally (i.e., in conjunction with the actuation of a power source-connected trigger switch), effect the energization of the drive motor coupled to the bit of a wire wrapping device.

Abstract: Beam machining methods are disclosed for adjusting the inductance of an inductive device having a core that substantially encloses coil means, and establishes a centrally located air gap. The inductance is adjusted by utilizing a high energy beam for machining a terminating end region of an inwardly extending core leg portion, the end face of which in part defines the air gap. By modifying the geometrical dimensions of the leg portion end face, the reluctance across the air gap may be readily changed by an amount that produces the desired value of inductance exhibited by the device when energized. The disclosed methods advantageously obviate the need for a tuning slug associated with the air gap, and eliminate the need for machine grinding the air gap-defining leg portions of the core prior to the assembly of the device.

Abstract: An open-ended, B-wire type of deformable connector has a thin, perforable insulative liner secured to the inner surface of the inner one of a pair of telescopically coaxially disposed metallic sleeves in accordance with several preferred liner assembly methods. The liner is positioned so as to overlie the distal ends of an array of insulation-piercing protuberances formed in the inner sleeve, and to extend continuously in both the circumferential and longitudinal directions at least to the perimeter of the array. During assembly, while the inner sleeve is being fabricated out of strip stock in a progressive manner, each liner in the form of a section of thin, plastic film stock is positioned on and firmly secured (such as by pressure bonding) to the partially fabricated planar sleeve section along at least the solid wall border regions thereof (surrounding the array of protuberances).