Abstract: The subject invention discloses a novel method of providing a binary electrolyte-solvent solution in a solid battery system. A first component of this binary electrolyte solvent system is provided by a material which acts as a plasticizer in the formation of a solid polymeric matrix (separator), composite cathode and/or composite anode, and which also acts as an electrolyte solvent in the completed electrochemical cell. The second component of the binary electrolyte solvent system is an electrolyte solvent, which generally carries the electrolyte salt into the electrolytic cell precursor. The first and second components of the binary electrolyte solvent system mix within the electrolytic cell, dispersing the electrolyte salt throughout the binary electrolyte solvent system. The addition of the electrolyte salt to the electrolytic cell precursor acts to activate the cell precursor, and to form a functional electrolytic cell or battery system.

Abstract: An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate. Electrical connections between the integrated circuit die and the package leads are provided. A rigid upper protective layer is present. The rigid upper protective layer encloses the integrated circuit die, and at least partially covers the top surface of the upper insulative layer. The semiconductor device package further comprises a rigid or semi-rigid metal lower protective layer opposite the upper protective layer including a ground plane proximal to the electrical leads and a power plane distal to the leads. Methods of production are also given.

Abstract: A method for activating the anode, cathode, and polymeric matrix components of an electrochemical cell is provided. Subsequent to forming the electrochemical cell precursor a quantity of activation fluid comprising electrolyte solvent and an inorganic salt is added into the electrochemical cell precursor at a rate such that substantially all of the activation fluid is incorporated into the electrochemical cell precursor. The method produces electrochemical cells having consistent amounts of solvent and salts therein.

Abstract: A novel processing method provides a separator or electrode film demonstrating good physical properties and excellent conductive properties. Specifically, a binder of a suitable polymer, such as a polyvinylidene difluoride (PVdF) homopolymer, and a filler material such as silica or alumina are homogenized, such as by ball milling, to form a mixture free of solvents or plasticizers. An appropriate plasticizer, such as dimethyl adipate, is mixed into the binder and filler materials, and the resulting material is formed into a sheet. The sheet is hot pressed or melt processed at a temperature greater than the softening point but less than the melting point of the polymer mix. Electrode films can also be made using the method herein.

Abstract: The subject invention provides a three-step process for electrolyte deposition. A surplus of electrolyte pre-wet material, having a relatively low viscosity, is layered onto a dry, porous electrode. Surplus pre-wet material is mechanically removed from the surface of the electrode. This also removes bubbles or foaminess which has developed in the pre-wet material. The pre-wet solution is allowed to absorb into the porous electrode, and the surface is then coated with the high-viscosity electrolyte precursor. Curing or further processing of the electrode/electrolyte then continues with standard processes.

Abstract: An improved method for transferring a semiconductor carrier tray is disclosed. The method herein provides for transferring a semiconductor carrier tray from a first location to a second location by first positioning a cap member to cover the mouth of at least one cup of a semiconductor carrier tray. The capping member contacts the uppermost surface of the cup wall. A partial vacuum is applied to the capped cup, and atmosphere is evacuated from the capped cup, adhering the semiconductor tray to the capping member. Movement of the capping member causes movement of the carrier tray from a first location to a second location. When the carrier tray has been positioned at its final destination, the vacuum is released causing separation of the carrier tray and the capping member. A vacuum cap apparatus is also disclosed.

Abstract: Apparatus for the biological purification of cutting oil, such as used in metal machining apparatus, is disclosed. The invention herein provides a suitable aerobic environment for remediating cultured aerobic bacteria. These beneficial bacteria act to break down the hazardous organic waste products of anaerobic bacteria and eliminate rank odors in the cutting oil. The cutting oil is aerated to encourage the proliferation of the aerobic bacteria, and to discourage the proliferation of the unwanted anaerobic bacteria.

Abstract: An improved anneal process is disclosed for use in the preparation of a dielectric layer, especially an intermetal dielectric layer. An oxide layer is deposited using a H.sub.2 O-TEOS PECVD process. A vacuum bake is used to minimize or eliminate volatile water, hydrogen, and hydrocarbon impurities in the dielectric layer. An oxidation anneal is then performed to scavenge any remaining undesirable species, and to provide for densification of the dielectric layer.

Abstract: The ball bump structure of the subject invention provides a hermetically sealed bond pad at the surface of a semiconductor chip. An adhesion pad is formed at the surface of the bond pad. The adhesion pad includes a barrier layer, preferably a titanium/tungsten alloy, and a bonding layer, for example, a sputtered gold layer. A gold ball bump is formed on the adhesion pad. Methods for forming the improved structure herein are also disclosed.

Abstract: Lead systems of the subject invention include "coplanar leads" and "aplanar leads", which differ in structure at the inner bond finger. Coplanar leads are generally planar along the lead body and the inner bond finger. Aplanar leads are bent or deformed at the inner bond finger, such that the inner bond finger terminus is not in the plane of the lead body but instead is above or below the plane of the lead body. Deforming select inner bond fingers out of the general plane of the lead system provides a spatial separation for the bonding wires which are attached to the inner bond fingers. This spatial separation acts to minimize wire crossing and shorting during fill processes and results in improved semiconductor package yield.

Abstract: A capillary flowcell of this invention comprises a holding means including an optical axis, the optical axis being defined by, in sequential order, (a) a first (entrance) aperture, (b) a first lens, (c) a capillary tube having its long axis centered across the optical axis, and (d) a second lens. The first lens focuses electromagnetic radiation from the entrance aperture passes through the inner diameter of the capillary tube, thus maximizing the signal generated by the analyte within the capillary tube. The second lens focuses electromagnetic radiation which has passed through the capillary tube. Methods and apparatus pertaining to the flowcell are given.

Abstract: A method for testing a lead connection to an integrated circuit chip is disclosed. The method comprises the steps of: (a) applying heat to an exposed surface of the integrated circuit chip; and (b) determining the heat transferred from the integrated circuit chip to a lead. Rapid transfer of heat to the lead indicates a valid connection between the integrated circuit chip and the electrical lead. Slow, non-uniform, or inadequate transfer of heat to the lead indicates an insufficiency or failure in the electrical connection between the integrated circuit and the lead. Determination of the heat transferred from the integrated circuit chip to the lead can be by any appropriate method. For example, the temperature of the lead can be determined using temperature probe, a liquid crystal display, or an electronically or visually scanned infrared display.

Abstract: The invention comprises a physical barrier which deters the entrance of snails and slugs into an enclosed area. In preferred embodiments, the barrier is a treated rigid edging (such as fencing, or benderboard of wood or plastic) or a treated flexible edging (such as a tape). The edging material has an exposed surface (e.g., at or above the soil level) which includes a particulate copper material in a polymeric matrix.

Abstract: A method and apparatus for the biological purification of cutting oil, such as used in metal machining apparatus, is disclosed. The invention herein provides a suitable environment for cultured aerobic bacteria. These beneficial bacteria act to break down the hazardous organic waste products of anaerobic bacteria and eliminate rank odors. The cutting oil is aerated to encourage the proliferation of the aerobic bacteria, and to discourage the proliferation of the unwanted anaerobic bacteria.