Patents Represented by Attorney Keating & Bennett
  • Patent number: 7049176
    Abstract: In a method of forming a thick-film wiring on a substrate, photosensitive-electroconductive paste is filled into a pattern groove formed on the surface of a light-transmitting intaglio plate. The pattern groove corresponds to a desired thick-film wiring pattern. The photosensitive-electroconductive paste filled in the pattern groove are irradiated with light-rays from the front and back sides of the intaglio plate to cause the paste to harden until the overall peripheral surface of the electroconductive paste has a predetermined hardness. The electroconductive paste hardened in the pattern grooves of the intaglio plate is transferred to an intermediate piece. Then, the electroconductive paste is transferred from the intermediate piece to a substrate. Thereafter, the electroconductive paste is fired, whereby a thick-film wiring is formed on the substrate.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: May 23, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tetsuya Oda, Choichiro Fujii, Etsuo Nishikawa
  • Patent number: 6897744
    Abstract: A longitudinally-coupled multi-mode piezoelectric bulk wave filter using the piezoelectric longitudinal effect includes a plurality of excitation electrodes extending substantially parallel to each other, a laminated piezoelectric body including a plurality of piezoelectric layers arranged between the excitation electrodes and polarized in a predetermined direction, an input electrode and output electrode disposed on a first side surface of the laminated piezoelectric body, and a ground electrode disposed on a second side surface of the laminated piezoelectric body. When an input signal is applied between the input electrode and the ground electrode, vibration modes of different orders of harmonic waves are excited and coupled so that an output signal is output between the output terminal and the ground terminal.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: May 24, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Mitani, Toshio Nishimura, Hiroaki Kaida, Jiro Inoue
  • Patent number: 6815868
    Abstract: A surface acoustic wave apparatus includes three longitudinally-coupled-resonator-type interdigital transducers (IDTs) having a balanced-to-unbalanced conversion function, which are provided on a piezoelectric substrate in a direction in which a surface acoustic wave (SAW) propagates. Weighting is applied to at least one of the IDTs. For example, among the electrode fingers of the IDT located on the left side, an apodization-weighted electrode finger is provided for one of the electrode fingers positioned adjacent to the central IDT.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: November 9, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Shibata, Yuichi Takamine, Hiroki Watanabe, Masaru Yata, Yoichi Sawada
  • Patent number: 6808405
    Abstract: In a coaxial connector, signal lines are switched over by mounting and dismounting a probe having a central contact, and fixed yoke terminals, a movable terminal, and a permanent magnet constitute a magnetic circuit. When the probe is dismounted, the contact portions are connected by the magnetic force of the permanent magnet. When the probe is mounted, the contact portions are disconnected against the magnetic force such that the central contact pushes a protrusion portion of the movable terminal.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: October 26, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Chikara Uratani, Takekazu Okada, Yuichi Maruyama, Yuichi Kushihi
  • Patent number: 6769159
    Abstract: A method for producing a ceramic electronic part includes forming a plurality of internal electrodes arranged in a ceramic sintered compact, superimposed via a ceramic layer. The free ends of the internal electrodes are formed to have a wedge-like cross-sectional shape, with the length L of the wedge and the internal thickness t of the electrode at the base of the wedge satisfying the relationship L>2t so that there is no risk of generating inter-layer peel-off or delamination in the ceramic layers.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: August 3, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tatsuo Haratani, Yasunobu Yoneda, Kyoshin Asakura