Patents Represented by Attorney, Agent or Law Firm Kenneth & Bennett LLP
  • Method of wiring formation and method for manufacturing electronic components
    Patent number: 6808641
    Abstract: A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: October 26, 2004
    Assignee: Murata Manufacturing Co., Ltd
    Inventors: Yoshiyuki Tonami, Yoshihiro Koshido