Abstract: This invention describes improved polishing pads useful in the manufacture ofsemiconductor devices or the like. The pads of the present invention may have an advantageous hydrophilic polishing material and are sufficiently thin to generally improve predictability and polishing performance.
Type:
Grant
Filed:
February 8, 2002
Date of Patent:
December 31, 2002
Assignee:
Rodel Holdings, Inc.
Inventors:
David B. James, Lee Melbourne Cook, Arthur Richard Baker
Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and are sufficiently thin to generally improve predictability and polishing performance.
Type:
Grant
Filed:
January 21, 2000
Date of Patent:
March 12, 2002
Assignee:
Rodel Holdings Inc.
Inventors:
David B. James, Lee Melbourne Cook, Arthur Richard Baker
Abstract: A polishing pad is provided comprising an upper surface and a lower surface, substantially parallel to one another, wherein the pad has enhanced flexibility produced by scoring of either or both surfaces. The pad thickness is generally greater than 500.mu.. The scoring creates slits having a depth of less than 90% of the thickness.