Patents Represented by Attorney, Agent or Law Firm Kenneth J. Cool
  • Patent number: 7295634
    Abstract: Briefly, in accordance with one embodiment of the invention, a portable communication device includes a quantization unit comprising an analog-to-digital converter and a signal generator. The output signal of the analog-to-digital converter may be adjusted to provide a feedback signal that is generated from by the signal generator and subtracted from an IF input signal.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: November 13, 2007
    Assignee: Intel Corporation
    Inventor: John S. Sadowsky
  • Patent number: 7206722
    Abstract: An enhancement filter for an oscilloscope is disclosed wherein the enhancement filter may be initially calibrated for one or more channels and/or for one or more attenuation settings such as 50 mV per division, 100 mV per division, and/or 200 mV per division, for example. In one embodiment, a desired filter response is selected to have a modified Gaussian type filter function having an at least approximately linear phase response, wherein the transfer function of the desired filter response comprises a step response that is be stored in the oscilloscope to be used as a part of calibration system of the oscilloscope.
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: April 17, 2007
    Assignee: Tektronix, Inc.
    Inventors: John J. Pickerd, Kan Tan
  • Patent number: 7072463
    Abstract: A line interface capable of connecting to a variety of transport mediums, each having a different impedance. The line interface comprises a programmable resistor. The programmable resistor along with an external resistor provide a range of resistor values which are used to substantially match the impedance requirements of the various transport mediums.
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: July 4, 2006
    Assignee: Intel Corporation
    Inventors: Russell Byrd, James M. Little
  • Patent number: 6980439
    Abstract: An integrated circuit packages comprises a printed circuit board, a non-metal connector, and a metal casing. The printed circuit board includes a ground ring around the non-metal connector. The metal casing substantially encloses the printed circuit board, and has an opening that allows access to the non-metal connector. The metal casing has a metal lip that makes physical and electrical contact with the ground ring of the printed circuit board. The metal casing may be used to help reduce EMI from a transmitter.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: December 27, 2005
    Assignee: Intel Corporation
    Inventors: Craig L. Schultz, Todd Micheal Petit, Joshua T. Oen
  • Patent number: 6980641
    Abstract: An enhanced telephone emulation computer system including a minidialer program for controlling a computer to add telephony functions which can be invoked from whatever active program is currently controlling the computer. The minidialer program controls the computer to alter its processing depending upon the context existing at the time when a mouse click or hot key combination event is detected indicating the user wishes to invoke a telephony function. The minidialer program determines whether the user has highlighted any text or numbers in the active window of the application currently controlling the computer and whether the highlighted material is a name or a phone number, and if a name, whether the name is stored with a phone number in a phone book or file maintained on the computer. Processing and telephony menu options displayed as available also depend upon whether the user is or is not on the phone at the time the mouse click or hot key event occurs.
    Type: Grant
    Filed: October 29, 1998
    Date of Patent: December 27, 2005
    Assignee: Intel Corporation
    Inventors: Michael D. Stanford, Ronald Scott Langham
  • Patent number: 6913999
    Abstract: A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: July 5, 2005
    Assignee: Intel Corporation
    Inventors: Damion T. Searls, Prateek J. Dujari, Bin Lian
  • Patent number: 6912469
    Abstract: An electronic hybridization assay implements a hybridization reaction, or a sequence analysis, on sequences representative of the sequences of the molecules under examination to provide an output representative of a chemical hybridization reaction. An electronic hybridization machine implements a correlation algorithm where the correlation output provides information regarding the relationship between the molecules under examination. In one aspect, the degree of similarity between the molecules is indicated by the correlation output value. In another aspect, a locus of similarity between the molecules is indicated by a maximum value in the correlation output sequence. In a particular aspect, the sequences are encoded in an optimized format to optimize the operation of the operation of the electronic hybridization machine.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: June 28, 2005
    Inventor: Kenneth J. Cool
  • Patent number: 6888668
    Abstract: An optical amplifier comprises a substrate, an optical multiplexer embedded in the substrate, pump light sources with multiple wavelengths coupled to the optical multiplexer, and an amplification waveguide coupled to the multiplexer. In one embodiment an optical signal is directed to another waveguide in the substrate. In another embodiment, the amplification waveguide is doped with a rare earth element.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: May 3, 2005
    Assignee: Intel Corporation
    Inventors: Dmitri E. Nikonov, Christopher J. Scholz
  • Patent number: 6886989
    Abstract: A device and method for aligning a fiber optic bundle with an array waveguide uses pins that partially extend into both the fiber optic bundle and the array waveguide to achieve course alignment. In one embodiment, the pins are inserted into holes formed by V-grooves in the fiber optic bundle. Finely aligning the fiber optic bundle and the array waveguide may be done by manual adjustment.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: May 3, 2005
    Assignee: Intel Corporation
    Inventor: Douglas E. Crafts
  • Patent number: 6876695
    Abstract: A communication device including a per finger interference reducer adapted to remove an interference effect of at least one pilot signal from the output of a despreader of the finger.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: April 5, 2005
    Assignee: Intel Corporation
    Inventor: Daniel Yellin
  • Patent number: 6859587
    Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: February 22, 2005
    Assignee: Intel Corporation
    Inventors: Dmitri E. Nikonov, Mark T. McCormack
  • Patent number: 6819836
    Abstract: A device has both electronic and photonic components on a shared substrate. The electronic components may include a light source for providing a photonic signal through the substrate to the photonic components.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: November 16, 2004
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Patent number: 6809337
    Abstract: A method of fabricating LCOS devices and testing them at the wafer-scale to identify known-bad dice, to facilitate completing fabrication of only known-good dice. A wafer-scale transparent electrode glass is temporarily placed over the wafer, and liquid crystal material is injected into the LCOS device cavities through fill holes extending through the wafer. After removing the glass and separating the wafer into dice, only the good dice have their die-scale glass attached, liquid crystal material re-injected, solder bumps affixed, and substrate attached.
    Type: Grant
    Filed: April 22, 2002
    Date of Patent: October 26, 2004
    Assignee: Intel Corporation
    Inventor: Paul Winer
  • Patent number: 6798314
    Abstract: Briefly, in accordance with one embodiment of the invention, a combiner may include transmission lines to couple a receive port and a transmit port to an antenna at a common junction. Shunt admittance elements may be utilized at the transmit and the receive ports to isolate one of the transmit and the receive ports from the antenna by shunting the at least one of the transmit and the receive ports to a power supply potential such as a ground reference. During a transmit mode, the shunt admittance element at the receive port may shunt the receive port to the power supply potential, thereby isolating the receive port from the antenna. During a receive mode the shunt admittance element at the transmit port may shunt the transmit port to the power supply potential, thereby isolating the transmit port from the antenna.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: September 28, 2004
    Assignee: Intel Corporation
    Inventor: Med A. Nation
  • Patent number: 6793408
    Abstract: A module comprises an electrical device having at least one memory device. A plurality of electrical contacts provide electrical signals to the electrical device. The memory apparatus also includes an optical interface, and an optical-to-electrical signal converter is coupled to receive optical signals from the optical interface and provide electrical signals to the electrical device.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: September 21, 2004
    Assignee: Intel Corporation
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Patent number: 6792179
    Abstract: An optical or optoelectroronic component is mounted to a substrate, and an optical thumbtack is inserted into a through-hole of the substrate. The optical thumbtack is positioned to receive light from or send light to the optical or optoelectronic component and provide a conditioned, for example collimated or focused, beam. The optical thumbtack comprises a lens portion, a spacer portion, and a foot portion. Light may enter the thumbtack from either direction.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: September 14, 2004
    Assignee: Intel Corporation
    Inventors: Daoqiang Lu, Gilroy J. Vandentop, Steven N. Towle, Henning Braunisch
  • Patent number: 6751456
    Abstract: A computer program for a user in a wireless communication system to communicate on the system. The communication protocol embodied in the computer program enables the user to acquire a channel on the base station in the system and register with a base station on the system. The communication protocol embodied in the computer program also enables the user to place and receive calls on the communication system. The communication protocol embodied in the computer program also provides the user a handover procedure for handing over its call to another base station in the system. The computer program is comprised of a main controller task and various other tasks, also called subtasks, which are activated by the main controller task. These subtasks are each designed to perform a protocol function for the user on the communication system.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: June 15, 2004
    Assignee: Intel Corporation
    Inventor: Izzet M. Bilgic
  • Patent number: 6707970
    Abstract: A device and method of aligning a fiber optic bundle with an array waveguide is achieved by mounting the fiber optic bundle and the array waveguide on a base. The fiber optic bundle is held by a high viscosity epoxy. The fiber optic bundle is moved until it is aligned. In one embodiment, an epoxy with high silicate content is used.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: March 16, 2004
    Assignee: Intel Corporation
    Inventor: Douglas E. Crafts
  • Patent number: 6633750
    Abstract: Apparatus and methods are provided for regulating the power consumption within a wireless communications mobile handset. A base station transmits an RF power output designating signal that indicates a desired level of the RF power output from the mobile handset. The mobile handset receives the RF power output designating signal, where it is used to set the level of the DC power supplied to the mobile handset. In this manner, the minimum amount of power necessary to maintain linear operation of the mobile handset is expended in the mobile handset. The DC power level is set by internally generating a control signal. The level of the control signal is dictated by the desired level of the RF power output as indicated by the received RF power output designating signal. The control signal is then applied to an RF amplifier circuit contained within the mobile handset to set the DC power level.
    Type: Grant
    Filed: September 10, 1999
    Date of Patent: October 14, 2003
    Assignee: Intel Corporation
    Inventors: Farron L. Dacus, Russell A. Morris
  • Patent number: 6628701
    Abstract: Apparatus and a method for receiving spread-spectrum signals is provided. The method includes the steps of detecting a noisy user signal from a spread-spectrum signal including at least a first user signal (including data therein) and at least one pilot signal, and removing an interference effect of the pilot signal on the first user signal from the noisy user signal thereby to create a noise reduced user signal.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: September 30, 2003
    Assignee: Intel Corporation
    Inventor: Daniel Yellin