Patents Represented by Attorney Kenrad H. Kaeding
  • Patent number: 6030899
    Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution free from particulate matter.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: February 29, 2000
    Assignee: Rodel, Inc.
    Inventors: Lee Melbourne Cook, David B. James, William D. Budinger