Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution free from particulate matter.
Type:
Grant
Filed:
July 29, 1999
Date of Patent:
February 29, 2000
Assignee:
Rodel, Inc.
Inventors:
Lee Melbourne Cook, David B. James, William D. Budinger