Abstract: A radiation—and/or heat-curable adhesive with high thermal conductivity includes the following recipe:
19 to 40 wt % of a difunctional acrylated, aromatic polyurethane;
9 to 25 wt % of (2-hydroxypropyl) acrylate or methacrylate;
1 to 5 wt % of one or more photoinitiators;
35 to 70 wt % of one or more mineral fillers;
0.5 to 3 wt. % of an SiO2-containing thixotropizing agent; and
0.5 to 2 wt % of an organic peroxide.
Type:
Grant
Filed:
January 30, 2001
Date of Patent:
November 12, 2002
Assignee:
Robert Bosch GmbH
Inventors:
Gerhard Liebing, Volker Brielmann, Achim Battermann, Juergen Perl