Patents Represented by Attorney Kevin L. Conlevy, Rose & Tayon Daffer
  • Patent number: 6137145
    Abstract: A semiconductor topography including integrated circuit gate conductors incorporating dual polysilicon layers is provided. The semiconductor topography includes a semiconductor substrate. A first gate conductor is arranged upon a first gate dielectric and above the semiconductor substrate, and a second gate conductor is arranged upon a second gate dielectric and above the semiconductor substrate. The semiconductor substrate may contain a first active region laterally separated from a second active region by a field region. The first gate conductor may be arranged within the first active region, and the second gate conductor may be arranged within the second active region. Each gate conductor preferably includes a second polysilicon layer portion arranged upon a first polysilicon layer portion. The thicknesses of the first gate conductor and the second gate conductor are preferably equal.
    Type: Grant
    Filed: January 26, 1999
    Date of Patent: October 24, 2000
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Jon D. Cheek, Daniel Kadosh, Mark W. Michael