Abstract: A semiconductor process in which a low temperature oxidation of a semiconductor substrate upper surface followed by an in situ deposition of polysilicon are used to create a thin oxide MOS structure. Preliminarily, the upper surface of a semiconductor substrate is cleaned, preferably with a standard RCA clean procedure. A gate dielectric layer is then formed on the upper surface of the substrate. A first polysilicon layer is then in situ deposited on the gate dielectric layer. An upper portion of the first polysilicon layer is then oxidized and the oxidized portion is thereafter removed from the upper surface of the first polysilicon layer. A second polysilicon layer is subsequently deposited upon the first polysilicon layer. Preferably, the formation of the gate dielectric on the semiconductor substrate upper surface comprises annealing the semiconductor substrate in an ambient comprising an inert species and O2.