Patents Represented by Attorney Kevin P. McAndrews

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  • Technique of increasing bond pad density on a semiconductor die
    Patent number: 5300815
    Abstract: A novel technique for increasing bond pad density is described whereby non-square bond pads are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith and are aligns to the approach angle of the conductive line to which it is connected. A variation on the inventive technique provides for alternating, interleaved, complementary wedge-shaped bond pads which provide for high bond pad density while accommodating a wide range of approach angles.
    Type: Grant
    Filed: August 25, 1992
    Date of Patent: April 5, 1994
    Assignee: LSI Logic Corporation
    Inventor: Michael D. Rostoker