Patents Represented by Attorney Kevin R. Casey
  • Patent number: 5109268
    Abstract: An improved semiconductor package is provided wherein the mounting pad for the semiconductor is made from a material selected from the group consisting of aluminum nitride, diamond, alumina, and boron nitride.
    Type: Grant
    Filed: December 29, 1989
    Date of Patent: April 28, 1992
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventor: Gasper A. Butera
  • Patent number: 5105260
    Abstract: An improved transistor package with superior stability to wave soldering, having a nickel oxide barrier strip formed on the surface of the leads.
    Type: Grant
    Filed: October 31, 1989
    Date of Patent: April 14, 1992
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventor: Gaspar A. Butera