Abstract: The present invention relates to a pump of resin deposition on a semiconductive wafer including a pump body divided by a membrane of definition of a resin dispensation chamber and of a control chamber and an element of filtration of the resin before its dispensation to an outlet access of the pump body. The pump includes a control system for injecting the resin under constant pressure into the control chamber and aspiring the resin from the control chamber, and a capacitive presence sensor for detecting a first position of the membrane.

Abstract: A weight measurement apparatus of the type for determining the weight of a load placed on a wheeled vehicle. The apparatus includes an elongated load bearing member coupled between the load and the wheels. The load bearing member has two apertures that extend completely through the load bearing member, and load sensors attached to the walls of the apertures for calculating the stress in the apparatus created by the load. The apparatus can further include a decoder for converting the stress measurement to a weight value and an onboard display device for displaying the weight of the load to the vehicle operator. The apparatus may be sized and shaped to retrofit existing structural components of a truck, thereby adding a weight measurement capability to the vehicle.