Patents Represented by Attorney, Agent or Law Firm Kevin W. Cyr
  • Patent number: 6783835
    Abstract: A bulk modulus elastomeric element is employed in the present invention. The material from which the invention is fabricated is formed as a sheet, which has a plurality of channels that run through, or partially through it. The holes in the sheet are angled such that the remaining material may be of a parallelogram shape. The top and bottom surfaces of the particular element may be rectangular, circular, hexagonal, or other shapes, since the shape of the end surface is not important to the invention. An edge of an upper end surface is displaced from a remote edge of the lower surface so that a vertical line from one edge normal to the upper surface, is displaced from the remote edge of the lower surface, so that it preferably does not intersect any part of the lower surface when no forces are applied to the surfaces. However, in some instances, under load, a small overlap at the cross-sectional areas of the upper surface and lower surfaces, may be desirable.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: August 31, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Trevor J. McCollough, Wesley E. Revely
  • Patent number: 6749924
    Abstract: A stack of sheet elastomers, each having multiple holes therein, dissipates shock forces applied to it. The elastomeric sheets are formed with identical holes each of which have a periphery that is symmetrical around the centers of the holes that extend over a shock dissipation area of the device. The sheets are stacked so that one, or more continuous material passageways are formed through the stack that extend from one support surface to a parallel support surface. This allows for the elastomer material of these passageways to transmit sheer shock forces when a compressive force is applied normal to the support surfaces. Elastomeric, or other material of a composition different, preferably elastomeric, from the material of the stacked sheets, may be filled into holes of the sheets to adjust the characteristics of the device.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: June 15, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Robert J. Monson, Trevor J. McCollough, Wesley E. Revely
  • Patent number: 6742776
    Abstract: A shock mount to support the static weight of a housing while at the same time effectively attenuating shock or vibration imparted to the housing with the shock mount having a shock isolator for supporting the weight of the display and a bezel extending around the display with the bezel comprising a second shock an d vibration isolator that coacts with the first shock set of shock isolators to further attenuate shock and vibration forces to the system.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: June 1, 2004
    Inventors: Robert James Monson, Julia Ann Neuman
  • Patent number: 6736547
    Abstract: An optical connector provides the reliability of a butt-coupled connection with the mating simplicity of an expanded-beam coupling arrangement. In an example embodiment, an optical fiber connector arrangement includes a first ferrule having an expanded-beam arrangement disposed therein. The expanded-beam arrangement within the first ferrule includes a first lens that is coupled to a first optical fiber and a second lens that is coupled to a second optical fiber, wherein the second optical fiber protrudes from the first ferrule. The connector arrangement further includes a second ferrule arranged to receive the first ferrule. The second ferrule supports a third optical fiber and is shaped to receive the first ferrule. The second optical fiber is butt-coupled to the third optical fiber within the second ferrule when the second ferrule is engaged with the first ferrule.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: May 18, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Rick C. Stevens, Kevin J. Thorson
  • Patent number: 6685363
    Abstract: An active optical device having a plurality of optical receiving or transmitting elements is secured to a carrier having two holes adapted to receive respective alignment pins of the connector. The optical device is secured to the carrier by a first solder ball contract array pattern on a surface of the optical device substrate and a second matching solder ball contact array pattern on a surface of the carrier. Solder balls disposed between the first solder ball contact array pattern of the optical device substrate and the second solder ball contact array pattern are melted so that solder reflow self-aligns the patterns, and further positions the optical device array in a predetermined orientation with respect to the alignment holes in the carrier. A flexible electrical interconnect member having a plurality of electrical traces is coupled to the active optical device at one of its ends and the other end is available for coupling to another device.
    Type: Grant
    Filed: September 18, 2002
    Date of Patent: February 3, 2004
    Assignee: Lockheed Martin Corporation
    Inventor: Charles J. Kryzak
  • Patent number: 6493590
    Abstract: An apparatus is provided for use in stimulating a body tissue or organ that has a flexible band electrode. The band electrode includes at least one slot configured to provide increased flexibility. A lead having the electrode is also provided as well as a method for manufacturing a band electrode having at least one slot.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: December 10, 2002
    Assignee: MicroNet Medical, Inc.
    Inventors: Bradley J. Wessman, Peter J. Pohndorf, Paul J. Robinson
  • Patent number: 6400976
    Abstract: An electrical lead for sensing electrical activity with the body of the patient and for applying electrical energy to selected body tissue comprises an elongated, flexible polymeric lead body having one or more conductors extending the length thereof, the conductors being connected at their distal end to electrode pads where the pads each comprise a multi-layer thin metallic film structure formed on the surface of the lead body where the overall thickness of the composite electrodes are less than about 5 microns. As such, the electrodes do not adversely impact the ability of the distal end portion of the catheter to flex and conform to tissue structures where sensing is to be taken and therapy delivered via the lead.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: June 4, 2002
    Inventor: Eugene J. Champeau
  • Patent number: D487434
    Type: Grant
    Filed: January 20, 2003
    Date of Patent: March 9, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Robert J. Monson, Douglas H. Azinger, Julia A. Neuman, Michael E. Smith, Jianhua (Jack) Yan
  • Patent number: D492676
    Type: Grant
    Filed: January 20, 2003
    Date of Patent: July 6, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Robert J. Monson, Douglas H. Azinger, Julia A. Neuman, Michael E. Smith, Jianhua (Jack) Yan