Patents Represented by Attorney Kevin W. Raasch
  • Patent number: 5935162
    Abstract: Radially-expandable stents are provided with improved longitudinal flexibility and stability, improved torsional flexibility and stability, improved trackability and conformability, and improved hoop strength. The stents combine the advantages typically associated with wire stents with those typically associated longitudinal stability.
    Type: Grant
    Filed: March 16, 1998
    Date of Patent: August 10, 1999
    Assignee: Medtronic, Inc.
    Inventor: Kenny L. Dang
  • Patent number: 5889615
    Abstract: Dual axis retroreflective articles and methods of using them are disclosed. The retroreflective articles may combine dual axis retroreflection with three axis retroreflection to provide a steady glow due to the three axis retroreflective portions of the article and also provide intermittent or flashing retroreflection as the plane of retroreflection from the dual axis retroreflector passes through or near the light source. The retroreflective articles may also include dual axis retroreflective structures in combination with sparkling reflective structures, as well as dual axis retroreflective structures in combination with both three axis retroreflective structures and sparkling reflective structures. Methods of use include moving the dual axis retroreflective structures to obtain intermittent or flashing retroreflection.
    Type: Grant
    Filed: June 27, 1997
    Date of Patent: March 30, 1999
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: John F. Dreyer, Kenneth M. White, Vera L. Lightle
  • Patent number: 5779732
    Abstract: Methods and apparatus for implanting a radially expandable stent and separate film within a body vessel. The film is separate from the stent and releasably retained thereon during advancement of the stent to the body vessel. Some methods according to the present invention include steps of providing a collapsed, radially expandable stent; providing a film that is separate from the stent, the film being provided in sheet form; wrapping the film around at least a portion of the stent; and releasably securing the film around the stent with at least one suture or by releasably attaching the first end of the film to a second end of the film. The apparatus according to the present invention include a collapsed, radially expandable stent and a film separate from the stent. The film is releasably attached around the stent by a suture or by releasably attaching the first end of the film to the second end of the film.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: July 14, 1998
    Assignee: Medtronic, Inc.
    Inventor: Rodney R. Amundson
  • Patent number: 5738642
    Abstract: A carrier delivered dressing is disclosed which has a conformable backing with a pressure sensitive adhesive coated on a bottom face and a low adhesion coating on a top face. The backing is supported during shipping and handling by a liner attached to the adhesive and a removable heat sealed carrier attached to the top face of the backing. The method according to the present invention discloses the steps of forming and optionally removing windows in a carrier material and nonpermanently heat sealing the carrier to the backing to form the dressings of the present invention.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: April 14, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Steven B. Heinecke, Donald G. Peterson
  • Patent number: 5358826
    Abstract: A method for simultaneously manufacturing metallized carriers from wafer-shaped substrates is described, wherein such wafer-shaped substrates permit the use of standard IC fabrication apparatus and methods. As a result, very thin and finely dimensioned traces can be deposited. Thin-film manufacturing techniques are used to create the high-density traces on the surface of the chip carriers, thereby permitting direct connections from the IC to the periphery of the carrier without the need for vias. A lid hermetically seals and protects the package. The traces are comprised of a plurality of metals to facilitate bonding, each of the metals homogeneous for a portion of the trace. One metal portion of the trace is of a type compatible with an IC chip placed in the carrier. Another metal portion of the trace is of a type compatible with a trace on a printed circuit board. A metal barrier is interposed between the metals to prevent metal diffusion from one metal to an adjoining portion of another metal.
    Type: Grant
    Filed: May 8, 1992
    Date of Patent: October 25, 1994
    Assignee: Cray Research, Inc.
    Inventors: Richard R. Steitz, Diane M. Christie, Eugene F. Neumann, Melvin C. August, Stephen Nelson