Patents Represented by Law Firm Kirkpatrick & Lockart LLP
  • Method for reducing damage to wafer cutting blades during wafer dicing
    Patent number: 6112740
    Abstract: A method of dicing a semiconductor wafer having a bottom side and a circuit side along a plurality of street indices. The method includes applying an adhesive to the bottom side of the wafer, placing the bottom side of the wafer on a chuck or a spacer having a plurality of recesses therein, aligning the street indices on the wafer with recesses in the chuck or spacer, and dicing the wafer along the street indices.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: September 5, 2000
    Assignee: Micron Technology, Inc.
    Inventors: James M. Wark, Salman Akram