Patents Represented by Law Firm Koda & Androllia
  • Method and apparatus for forming a ball in wire bonding
    Patent number: 5957371
    Abstract: In a fixed type discharge electrode system employed for forming a ball on a bonding wire, a magnet is provided on, for instance, the discharge electrode so as to apply a magnetic field that causes the portion of an electric spark facing the bonding wire to be bent and positioned beneath the bonding wire.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: September 28, 1999
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Fumio Miyano, Kuniyuki Takahashi