Patents Represented by Attorney Konrad H. Kaeding
  • Patent number: 8124223
    Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: February 28, 2012
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: Kuppusamy Kanakarajan, Arnold Frances
  • Patent number: 8034534
    Abstract: The present invention relates to partially fluorinated (meth)acrylic polymers that can be blended with other (meth)acrylic polymers to provide enhanced surface properties.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: October 11, 2011
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: William Brown Farnham, Suniti Moudgil
  • Patent number: 7939350
    Abstract: The present invention relates to a method for encapsulating a substrate, which comprises: (a1) providing a substrate with a plurality of chips mounted on a top of the substrate; (b1) compressing a dry film photoresist on the top side of the substrate to form a photoresist layer; (c1) exposing the photoresist layer to a light source through a mask to form unexposed photoresist regions and exposed photoresist regions; (d1) developing the photoresist layer to uncover underlying portions of the unexposed photoresist regions; (e1) molding the top side of the substrate with a molding material; (f1) curing the molding material; and (g1) removing the unexposed photoresist regions from the substrate with a photoresist-removing agent.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: May 10, 2011
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Bin-Hong Tsai
  • Patent number: 7834113
    Abstract: The present invention relates to novel photoresist compositions and processes for preparing the same utilizing polymers having a low polydispersity via the use of certain chain transfer agents (CTA) with certain monomers to provide said polymers. The polymers incorporating the chain transfer agents can be homopolymers, or made with additional monomers to provide copolymers. These polymers/copolymers are then converted into photoresist compositions for use as such.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: November 16, 2010
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: James R. Sounik, Frank Leonard Schadt, III, Michael Fryd
  • Patent number: 6099394
    Abstract: A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, polishing pad comprising a high modulus phase and a low modulus phase. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
    Type: Grant
    Filed: March 27, 1998
    Date of Patent: August 8, 2000
    Assignee: Rodel Holdings, Inc.
    Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr.
  • Patent number: 6042741
    Abstract: A composition is provided for polishing a composite comprised of silica and silicon nitride comprising: an aqueous medium, abrasive particles, a surfactant, and a compound which complexes with the silica and silicon nitride wherein the complexing agent has two or more functional groups each having a dissociable proton, the functional groups being the same or different.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: March 28, 2000
    Assignee: Rodel Holdings, Inc.
    Inventors: Sharath D. Hosali, Anantha R. Sethuraman, Jiun-Fang Wang, Lee Melbourne Cook
  • Patent number: 6036579
    Abstract: An innovative method of manufacturing polishing pads using photocuring polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: March 14, 2000
    Assignee: Rodel Inc.
    Inventors: Lee Melbourne Cook, David B. James, Nina G. Chechik, William D. Budinger
  • Patent number: 6022268
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
    Type: Grant
    Filed: April 3, 1998
    Date of Patent: February 8, 2000
    Assignee: Rodel Holdings Inc.
    Inventors: John V. H. Roberts, David B. James, Lee Melbourne Cook
  • Patent number: 6022264
    Abstract: A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, hydrophilic polishing pad capable of releasing particles during polishing. Such a pad design is very efficient in providing polishing particles over the entire polishing surface interface. Since the polishing pad produces polishing particles, the polishing fluid can comprise very low loadings of polishing particles, if any.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: February 8, 2000
    Assignee: Rodel Inc.
    Inventors: Lee Melbourne Cook, David B. James, William D. Budinger
  • Patent number: 6019666
    Abstract: This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece.
    Type: Grant
    Filed: May 8, 1998
    Date of Patent: February 1, 2000
    Assignee: Rodel Holdings Inc.
    Inventors: John V. H. Roberts, Lee Melbourne Cook, David B. James, Heinz F. Reinhardt
  • Patent number: 6001269
    Abstract: A process is provided for polishing a composite comprised of an insulating layer, a metal and titanium in which the composite is polished in a standard polishing machine using an aqueous slurry comprising submicron abrasive particles, an iodate, and a peroxide. Another process is provided in which peroxide is added to the aqueous slurry only when a titanium or titanium nitride layer is being polished. Further the invention also comprises the addition of a base to the slurry stream exiting the polishing machine to bring the pH of the used slurry to about 7 or higher.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: December 14, 1999
    Assignee: Rodel, Inc.
    Inventors: Anantha R. Sethuraman, Lee Melbourne Cook, Huey-Ming Wang, Guangwei Wu
  • Patent number: 5932486
    Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution essentially free from particulate matter.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: August 3, 1999
    Assignee: Rodel, Inc.
    Inventors: Lee Melbourne Cook, David B. James, William D. Budinger
  • Patent number: 5253461
    Abstract: The present invention relates to low slope roofing systems, particularly in commercial (as opposed to residential) roofing applications. More specifically, the fastener-free roofing system of the present invention is directed to the use of a curing adhesive composition which will simply and safely secure roofing insulation to a roofing deck without the need for mechanical fasteners.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: October 19, 1993
    Assignee: Tremco, Inc.
    Inventors: Ronald J. Janoski, Gregory Rudolph, Rick J. Gibson, Donald C. Portfolio
  • Patent number: 5254167
    Abstract: An apparatus (10) for applying fluid roof panel adhesive to a substrate includes a holding tank (12) for holding a supply of adhesive vertically above the substrate. The tank is supported by a pair of spaced wheels (14) and has a handle (16) to enable moving the device over the substrate. Openings (32) in a lower wall (30) of the tank enable adhesive to flow onto the substrate. Blocking members (36) associated with each opening are movable in response to the position of a lever (20) to enable or prevent flow of adhesive through the openings. Movement of the apparatus over the substrate provides for controlled deposition of uniformly spaced beads of adhesive suitable for holding roof panels to the substrate.
    Type: Grant
    Filed: September 10, 1991
    Date of Patent: October 19, 1993
    Assignee: Tremco, Inc.
    Inventors: Ronald J. Janoski, Richard J. Gibson, Donald C. Portfolio, Gregory J. Rudolph, Todd P. Hadaway
  • Patent number: 5252154
    Abstract: The present invention relates generally to window glazing systems, particularly for high-rise commercial buildings. More specifically, the gasket system of the present invention is directed to a gasket system which can be partially fabricated in pieces off site, then the pieces are heat bonded together on site to thereby provide a substantially unitary gasket construction which is capable of sealing around the perimeter of multiple windows of a commercial building.
    Type: Grant
    Filed: August 9, 1991
    Date of Patent: October 12, 1993
    Assignee: Tremco, Inc.
    Inventor: Kenneth P. Hoffman
  • Patent number: 5234730
    Abstract: Command-cure compositions especially for use in insulated window assemblies permit the composition to be rendered adhesively bonding at a selected time interval after formation of the assembly to firmly bond opposed surfaces of the assembly; a particular adhesive in strip or tape form comprises an adhesive polymer composition which is transparent to curing radiation especially UV, and curable in the presence of the radiation; the curing is inhibited by oxygen; the composition is solvent free and cures to a mass resistant to water; surfaces of the adhesive exposed to oxygen remain tacky and uncured; the adhesive is especially useful in window structures in which adhesion of the tacky surface excludes the cure-inhibiting oxygen and the tacky surface can be cured by UV radiation passing through the window glass.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: August 10, 1993
    Assignee: Tremco, Inc.
    Inventors: Friedrich K. W. Lautenschlaeger, Reynaldo G. Bumanlag, James A. Box
  • Patent number: 5209034
    Abstract: Fogging and discoloration of multi-pane windows is prevented by sealing the windows with a polymeric seal and by sorbing off-gases evolved by the seal through the use of diatomaceous earth. The diatomaceous earth can be disposed within the volume defined by the panes and the seal, preferably by being disposed within a hollow spacer, or the diatomaceous earth can be mixed with the seal itself. If the diatomaceous earth is mixed with the seal, it can constitute about 1-15 percent by volume of the seal, preferably 1-2 percent by volume. Diatomaceous earth has been found to be especially effective in preventing fogging and discoloration of low emissivity glass.
    Type: Grant
    Filed: December 18, 1990
    Date of Patent: May 11, 1993
    Assignee: Tremco, Inc.
    Inventors: James A. Box, Thomas W. Greenlee, Lori A. Postak
  • Patent number: 5196455
    Abstract: The present invention relates to a one-part, self-leveling urethane sealant composition for substantially horizontal surfaces, wherein the sealant will flow within a crack, joint or the like and quickly cure to provide an elastomeric seal having a smooth, substantially horizontal surface. The cured sealant provides a surface and volume cure time superior to many known systems, and once cured, provides an elastomeric seal having a superior void volume and void distribution than many known self-leveling sealant systems.
    Type: Grant
    Filed: May 30, 1991
    Date of Patent: March 23, 1993
    Assignee: Tremco Incorporated
    Inventor: Joy Bryant
  • Patent number: 5110972
    Abstract: The present invention relates generally to the re-utilization of silicone scrap material. More specifically, the process of the present invention is directed to dissolving silicone scrap in an appropriate solvent and chemically converting the scrap into dimethyl silicone cyclic trimer, tetramer, pentamer and/or the like by means of a two step acid/base catalyzed cracking process.
    Type: Grant
    Filed: July 18, 1991
    Date of Patent: May 5, 1992
    Assignee: Tremco Incorporated
    Inventor: Thomas W. Greenlee
  • Patent number: 5106663
    Abstract: The present invention relates generally to multi-paned window systems and to the manufacture of such systems. More specifically, the present invention is directed to an improved window system having an innovative seal comprising crush resistant beads or the like wherein the seal can be compressed only to a substantially uniform and substantially predefined thickness and wherein the seal provides exceptional insulation, weather resistance and adhesion characteristics.
    Type: Grant
    Filed: March 7, 1989
    Date of Patent: April 21, 1992
    Assignee: Tremco Incorporated
    Inventor: James A. Box