Abstract: A lever plate in a VGS type turbocharger that is incorporated in an exhaust guide assembly in a VGS type turbocharger. The lever plate has a fitting hole into which a shaft part of the adjustable vane is fitted formed at a position close to one end of an elongated plate main body thereof and an engaging protrusion to be engaged with the drive ring formed at the other end thereof. The engaging protrusion is formed by bending a blanking material having the shape of an elongated flat plate. The engaging protrusion is pressed in a direction of raising thereof so as to have a thickness greater than the thickness of the plate main body of the lever plate, and opposite side peripheries of the engaging protrusion are subjected to finish blanking to have an arc shape.

Abstract: An object is to provide a showcase capable of improving the appearance of an illumination apparatus itself and improving the illumination effect produced by the illumination apparatus. In the showcase in which the inside of a display chamber disposed in a main body is illuminated by an illumination apparatus, the illumination apparatus includes an LED illumination member having an LED element, and a holding member attached to the main body to hold the LED illumination member, and the holding member includes a lead wire receiving portion for receiving a lead wire of the LED illumination member.

Abstract: The high-frequency circuit cooling apparatus comprises a package container 14 for housing a high-frequency circuit, a tank 16 for storing a gas to be introduced into the package container 14, a cold head 12 for cooling the package container 14 and the tank 16, pipes 24, 26 connected to the tank 16, for supplying the gas into the tank 16, pipes 18, 22 detachably connected between the tank 16 and the package container 14, for introducing the gas in the tank 16 into the package container 14, and pipes 34, 36 detachably connected to the package container 14, for discharging the gas in the package container 14.

Abstract: An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed in the via hole, and a connection terminal on which an optical device is mounted and which is connected to an upper end side of the conductor, wherein the connection terminal is embedded in an upper-side portion of the via hole or is projected from the insulating film.

Abstract: Abnormal values of an objective variable are removed. A degree of association between an objective variable and a plurality of explanatory variables is calculated. A plurality of explanatory variables having a high degree of association are extracted. A degree of independence between the explanatory variables is calculated. A plurality of candidates of explanatory variables with a high possibility of having a great effect on the objective variable are selected based on the degree of association and the degree of independence. An explanatory variable having a high rate of contribution to the objective variable is selected from among the candidates, based on the cumulative contribution rate, and a regression equation is calculated to estimate a value of the objective variable. The same processing is repeated, using the difference as a new objective variable and explanatory variables except the explanatory variable used to obtain the difference as new explanatory variables.

Abstract: Two semiconductor substrates are first bonded together by means of a metal bump, while respective one-side surfaces on which device patterns are formed are faced each other, and a resin is then filled into a gap between the respective one-side surfaces and thereafter each of the semiconductor substrates is polished and thinned to a prescribed thickness. Furthermore, a via hole and an insulating film are formed; part of a portion in contact with the metal bump, of the insulating film, is opened; the inside of the via hole is filled with a conductor; and an electrode pad is formed on the conductor, to thereby form structures. Finally, a required number of structures are electrically connected with each other through the electrode pad and stacked to thereby obtain a semiconductor device.

Abstract: A digital camera includes a CCD imager which outputs 640 pixels×480 lines of camera signal in a raster scan scheme. The camera signal outputted from the CCD imager is subjected to a predetermined signal processing whereby created are 640 pixels×480 lines of original image data and 80 pixels×60 lines of thumbnail image data. Both the created original image data and thumbnail image data are written to a SDRAM. The writing of the thumbnail image data is performed during a horizontal blanking period of the original image data. As a result, image data writing operation completes within a 1-frame period of time.

Abstract: According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of the substrate. During the sputtering, not only the targets but also magnetic field forming devices are moved relative to the targets, and therefore, a large area of the targets can be sputtered. In addition, when the magnetic field forming devices are also moved with respect to the substrate, the region of the target which is highly sputtered, moves with respect to the substrate, so that the thickness distribution of the film formed on the substrate can be even more uniform.