Abstract: A method of forming a DRAM storage cell with a trench capacitor in an SOI substrate is taught. The method involves forming an field effect transistor (FET) consisting of a source, drain, channel regions in a device layer, a gate oxide layer on the surface of the device layer and a gate electrode over the channel region.
Type:
Grant
Filed:
December 13, 1996
Date of Patent:
June 23, 1998
Assignee:
International Business Machines Corporation