Abstract: This invention relates to a piston for reciprocating and simultaneously rotating through a predetermined length of movement within a piston bore having a piston bore surface, and a method for reducing wear on a piston bore surface operatively associated with a piston which is subject to cocking forces. The piston includes a means on its extreme portion for providing continuous, tangential cooperation with the piston bore surface within the predetermined length of piston movement to reduce wear on the piston bore surface.

Abstract: A cost-effective process for providing a copper-based alloy casting, which has superior wear characteristics, to a cylinder block is described. The process includes providing a negative pressure around the cylinder block and a copper-based alloy. The process further includes heating the copper-based alloy to a submolten state for immersing the cylinder block within such, while promoting the entrained gas within the copper-based alloy to migrate in a given direction and terminate in a specified portion of the copper-based alloy to effectively control porosity. The process further includes cooling the immersed cylinder block in the given direction to effectively reduce microshrinkage of the copper-based alloy.

Abstract: The device permits locking of a control knob which can rotate around a cylindrical support and includes a lateral face with at least one first locking boss and a lateral face of a ring which has at least one second locking boss. The ring is movable in translation according to the axis between a locked position of the knob, in which the ring is prevented from rotating around the axis when the first and second bosses are engaged, and between a released position in which the first and second bosses are decoupled.

Abstract: A cost-effective process for preventing mealing of a polyurethane conformal coating applied to a printed wiring board is described. The process includes utilizing a liquid photoimagable solder mask for protecting the circuitry within the board prior to applying the polyurethane conformal coating. The process further includes applying the polyurethane coating within a controlled maximum thickness of 0.0015 inches for preventing vesication of the conformal coating. Additionally, a manufactured printed circuit substrate incorporating these steps is described.

Abstract: This invention relates to a non-electrolytic process for applying a paint adherent and corrosion resistant coating of magnesium phosphate and magnesium fluoride to a product formed from a magnesium alloy. The process includes immersing the magnesium alloy product in a solution having phosphate and fluoride ions. The process may further include controlling a pH level of the solution, providing the solution in which the magnesium alloy product is immersed with a concentration by weight of sodium bifluoride, and controlling the solution at a certain temperature, while the magnesium alloy product is immersed for a determined period of time.

Abstract: This invention relates to a method of combining a plurality of surface mount technology components and at least one plated through-hole component on a printed wiring board. The method includes applying to a secondary side of the printed wiring board a first layer of a preselected quantity of electrically conductive adhesive and then attaching a first portion of the plurality of the surface mount technology components to the adhesive. The first layer of the adhesive is then reflowed, thereby adhering the first portion of the plurality of surface mount technology components to the secondary side of the printed wiring board. The method then continues by applying to a primary side of the printed wiring board a second layer of the first preselected quantity of electrically conductive adhesive and applying to the primary side of the printed wiring board a second preselected quantity of electrically conductive adhesive.

Abstract: This invention relates to a cooling apparatus for at least one electronic component. The cooling apparatus includes a first member which has an inner surface and an outer surface. The outer surface of the first member is adapted for mounting the electronic component thereon at a preselected location. The cooling apparatus also includes a venturi member which is fixedly secured to the inner surface of the first member. The venturi member is positioned to direct a cooling fluid to flow in thermal communication with the inner surface of the first member. The venturi member is also positioned to control a flow velocity of the cooling fluid flowing in thermal communication with a preselected portion of the inner surface of the first member. The preselected portion of the inner surface of the first member is opposite to the preselected location of the outer surface of the first member.

Abstract: This invention relates to a piston and a method of manufacturing the same. The piston includes a substantially cylindrical member having a first end and a second end. The cylindrical member includes an open cavity extending axially from the second end to adjacent the first end such that the second end has an inner annular surface defined by an inner diameter. The piston further includes a disk having a radially outer surface defined by an outer diameter fixedly secured to the second end of the cylindrical member. The outer diameter of the disk is substantially equal to the inner diameter of the inner annular surface of the second end of the cylindrical member. A circumferentially extending recessed area for receiving particles produced while fixedly securing the disk to the second end of the cylindrical member is provided on either the radially outer surface of the disk or the inner annular surface of the second end of the cylindrical member.

Abstract: This invention relates to a method of sealing resin to an alloy casting using either an aromatic solvent or an aqueous-based solution. The method includes providing a resin and combining the aromatic solvent with the resin to form a sealing coating which has a predetermined concentration by volume of resin to sealing coating. The method continues by heating the alloy casting to a first predetermined temperature and then selectively applying the sealing coating to the heated alloy casting. Finally the heated alloy casting is baked at a second predetermined temperature for a predetermined time period. Variations of this process using an aqueous-based solution include providing an aqueous-emulsified resin, and then combining the aqueous-emulsified resin with at least one base solvent to form a final aqueous-based solution which has a predetermined concentration by volume of base solvent to final aqueous-based solution. The process allows for the selection of differing materials to be combined.

Abstract: An improved method of manufacturing a piston is provided. The piston includes a substantially cylindrical member having a first end and a second end. The cylindrical member includes an open cavity extending axially from the second end to adjacent the first end such that the second end has an inner annular surface defined by an inner diameter. The piston further includes a disk having a radially outer surface defined by an outer diameter fixedly secured to the second end of the cylindrical member. The outer diameter of the disk is substantially equal to the inner diameter of the inner annular surface of the second end of the cylindrical member. A circumferentially extending recessed area for receiving particles produced while fixedly securing the disk to the second end of the cylindrical member is provided on either the radially outer surface of the disk or the inner annular surface of the second end of the cylindrical member.

Abstract: This invention relates to a method of combining a plurality of surface mount technology components and at least one plated through-hole component on a printed wiring board. The method includes applying to a secondary side of the printed wiring board a first layer of a preselected quantity of electrically conductive adhesive and then attaching a first portion of the plurality of the surface mount technology components to the adhesive. The first layer of the adhesive is then reflowed, thereby adhering the first portion of the plurality of surface mount technology components to the secondary side of the printed wiring board. The method then continues by applying to a primary side of the printed wiring board a second layer of the first preselected quantity of electrically conductive adhesive and applying to the primary side of the printed wiring board a second preselected quantity of electrically conductive adhesive.