Patents Represented by Attorney Kubotera & Associates, LLC
  • Patent number: 8348699
    Abstract: An electrical connector includes a connector main body made of an insulating material for attaching an end portion of a pair of single wires untwisted at an end portion of a twisted pair cable; and a shell member to hold the untwisted portion. The shell member includes a base portion made of a conductive material to dispose the connector main body at the front end side and the untwisted portion at the basal end side; a cable holding portion made of a conductive material to hold the single wires at the untwisted portion for positioning the single wires parallel to each other and close or contact to each other; and a cover portion provided on the base portion to have at least the untwisted portion and the cable holding portion between the cover portion and base portion.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: January 8, 2013
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Takashi Nagawatari, Naohisa Nakata, Tadashi Kubota
  • Patent number: 8343340
    Abstract: To provide a flowing water splitting apparatus, a flowing water splitting method, and a sewage system each capable of enhancing the flow quantity splitting function for flowing water by a simple structure to reduce the flow quantity of the flowing water flowing to a dirty water pipe.
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: January 1, 2013
    Inventor: Shuhei Oda
  • Patent number: 8342895
    Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: January 1, 2013
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Kazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa
  • Patent number: 8346109
    Abstract: An image forming apparatus includes an image supporting member; a developer supporting member for attaching developer to a static latent image formed on a surface of the image supporting member; a developer layer forming member for forming a developer layer on the developer supporting member; a developer supply member for supplying developer to the developer supporting member; a developer supporting member voltage applying unit for applying a voltage to the developer supporting member; a developer supplying member voltage applying unit for applying a voltage to the developer supplying member; and a reset operation processing unit for setting a reset mode over a specific period of time, so that a bias difference in the reset mode between the voltage applied with the developer supporting member voltage applying unit and the voltage applied with the developer supplying member voltage applying unit becomes smaller than that in a printing mode.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: January 1, 2013
    Assignee: Oki Data Corporation
    Inventor: Tsutomu Yamane
  • Patent number: 8342869
    Abstract: A circuit board electrical connector to be disposed on a circuit board includes a housing and a plurality of terminals arranged in the housing. The housing includes a receiving space with an upper opening portion to receive a flat conductive member and a housing space with a lower opening portion that communicates with the receiving space. Each of the terminals has a connecting section and a contact section. The circuit board electrical connector has a portion to house a middle section of the terminal between the connecting section and the contact section. The portion is a region includes a range that overlaps at least with the upper opening portion and lower opening portion when viewed from an upper side, and is made wider at a gap between an inner surface of the housing space and the terminal than a gap other than the region.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: January 1, 2013
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Seiji Okamura
  • Patent number: 8337726
    Abstract: In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D).
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: December 25, 2012
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Takuya Harada, Hidemichi Fujiwara, Kazuhiro Takashiba, Nobumitsu Yamanaka, Yusuke Yamada, Hideo Nishikubo, Takashi Unno
  • Patent number: 8335004
    Abstract: A printing system includes a plurality of printing apparatus; a plurality of host devices sharing the printing apparatus; and an administrative server for administrating the printing apparatus and the host devices. In the printing system, the printing apparatus, the host devices, and the administrative server are connected to with each other through a network. The printing apparatus are operated one of a plurality of operation modes. The administrative server instructs the printing apparatus to operate one of the operation modes according to mode setting information.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: December 18, 2012
    Assignee: Oki Data Corporation
    Inventor: Takanori Oosawa
  • Patent number: 8333606
    Abstract: An electrical connector includes a housing and terminals made of a sheet metal, which are held by the housing. The plurality of terminals is arranged in a direction perpendicular to a contact surface of a contact section thereof, and is held by the housing. Each of the terminals has a held section to be held by the housing, a contact section to contact with a mating terminal, and a connecting section to be connected to a circuit board each forming a flat sheet surface. The contact section is formed to have a flat contact surface, which slidably contacts with the mating terminal and extends in a connector fitting direction.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: December 18, 2012
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Yohei Hasegawa
  • Patent number: 8329561
    Abstract: A method of producing a semiconductor device includes: a dicing step of dicing a wafer member using a dicing blade to form a cut portion in the wafer member, in which the wafer member is formed of a wafer portion, a glass substrate, and an adhesive layer for bonding the wafer portion and the glass substrate in a thickness direction of the wafer member so that the cut portion penetrates the wafer portion and the adhesive layer and reaches a part of the glass substrate; and an individual piece dividing step of dividing the wafer member into a plurality of semiconductor devices with the cut portion as a fracture initiation portion.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: December 11, 2012
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Yoshihiro Saeki
  • Patent number: 8326191
    Abstract: A developing device includes a developer supporting member for supplying developer to an image supporting member; a developer supplying member for supplying developer to the developer supporting member; and a stirring member disposed to be freely rotatable. The stirring member includes a free end portion arranged to contact with the developer supplying member and a stirring section for stirring developer when the stirring member rotates.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: December 4, 2012
    Assignee: Oki Data Corporation
    Inventor: Takuya Goto
  • Patent number: 8326192
    Abstract: A developer supplying member includes a foamed member formed of continuous foams for supplying developer to a developer supporting member. The foamed member has a high resistivity in terms of electrical conductivity through ion conductivity, and has a low resistivity in terms of electrical conductivity after carbon black is attached to foam cell walls thereof.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: December 4, 2012
    Assignee: Oki Data Corporation
    Inventor: Satoru Furuya
  • Patent number: 8322706
    Abstract: A medium transport device includes a transport unit for transporting a medium, and a guide member disposed on a downstream side of the transport unit in a direction that the medium is transported. The guide member includes a first portion corresponding to the transport unit and a second portion having a shape different from that of the first portion.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: December 4, 2012
    Assignee: Oki Data Corporation
    Inventor: Takahiro Sunohara
  • Patent number: 8288804
    Abstract: Provided is a carbon nanotube field effect transistor manufacturing method wherein carbon nanotube field effect transistors having excellent stable electric conduction property are manufactured with excellent reproducibility. After arranging carbon nanotubes to be a channel on a substrate, the carbon nanotubes are covered with an insulating protection film. Then, a source electrode and a drain electrode are formed on the insulating protection film. At this time, a contact hole is formed on the protection film, and the carbon nanotubes are connected with the source electrode and the drain electrode. Then, a wiring protection film, a conductive film and a plasma CVD film are sequentially formed on the insulating protection film, the source electrode and the drain electrode. In the field effect transistor thus manufactured, since the carbon nanotubes to be the channel are not contaminated and not damaged, excellent stable electric conductive property is exhibited.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: October 16, 2012
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Hiroaki Kikuchi, Osamu Takahashi, Katsunori Kondo, Tomoaki Yamabayashi, Kunio Ogasawara, Tadashi Ishigaki, Yutaka Hienuki, Motonori Nakamura, Agus Subagyo
  • Patent number: 8284219
    Abstract: A drive circuit for supplying a drive current to a plurality of driven elements includes a plurality of drive output terminals to be connected to the driven elements. The drive output terminals are arranged with a specific pitch in between in an arrangement direction. The drive circuit further includes a plurality of drive transistors. Each of the drive transistors is arranged in an occupied area with a specific width in the arrangement direction larger than the specific pitch.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: October 9, 2012
    Assignee: Oki Data Corporation
    Inventor: Akira Nagumo
  • Patent number: 8282399
    Abstract: An electrical connector includes a housing having an opening portion in an upper surface thereof including a width edge in a short side direction and a side edge in a long side direction; a terminal disposed in the housing; and a suction member detachably attached to the housing. The suction member includes a plate portion for covering the housing and an attachment portion for attaching to the housing at a middle portion of the side edge. The plate portion includes an attachment region between both end portions of the attachment portion in the long side direction and a non-attachment region outside the attachment region extending to a distal end portion of the plate portion in the long side direction. The non-attachment region includes a deformable portion with a free end portion to be deformable.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: October 9, 2012
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Takeshi Saito, Masakazu Ezaki, Toshiyuki Takada
  • Patent number: 8285172
    Abstract: An image forming apparatus includes an image forming unit an original reading unit and a guide mechanism. The image forming unit includes a sheet supply unit; a transportation roller for transporting a medium from the sheet supply unit; an image drum unit for forming a toner image on a photosensitive drum; a transfer belt unit for transferring the toner image on the photosensitive drum to the medium; a fixing device for fixing the toner image to the medium; and a stacker for placing the medium. The original reading unit includes an original stage for placing an original; a scanner unit disposed below the original stage; and a transportation unit for transporting the original to the original stage and a sheet discharge unit. The guide mechanism includes a pair of guide walls integrally formed at upper edges of the image forming unit.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: October 9, 2012
    Assignee: Oki Data Corporation
    Inventor: Hideki Enomoto
  • Patent number: 8283032
    Abstract: The present invention relates to an electrical contact material having a surface layer made of a noble metal or an alloy having the noble metal as its main component, a method for manufacturing the same and an electrical contact using the same. Recently, electrical contact materials having excellent abrasion resistance are used for sliding electrical contacts such as a connector terminal of an automobile harness, a contact switch mounted in a cellular phone and terminals of a memory card. Although there have been known ones having an organic coating film composed of either aliphatic amine or mercaptan or a mixture of the both provided on the electrical contact material described above as the electrical contact materials having excellent abrasion resistance, they have had problems that even though they are effective with a low load of 0.5 N or below, abrasion accelerates when the load exceeds 0.5 N and sliding characteristics drop under a high-temperature environment.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: October 9, 2012
    Assignee: Furukawa Electric Co., Ltd.
    Inventor: Yoshiaki Kobayashi
  • Patent number: 8283678
    Abstract: An optical module can reliably provide monitor light and can facilitate manufacturing by reducing the number of lens surfaces. Based on a surface shape of each first lens surface (14), the relationship in length between the optical path length of the second optical path and the optical path length of the first optical path after reflecting/transmission surface (17) and whether or not second lens surfaces are formed in second surface (4b) based on this relationship in length, the spot diameter of light of each light emitting element (7) to be coupled to the end surface of each optical fiber (3) is made narrower than a spot diameter of monitor light to be coupled to each light receiving element (8).
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: October 9, 2012
    Assignee: Enplas Corporation
    Inventor: Shimpei Morioka
  • Patent number: 8283743
    Abstract: A photodiode includes a silicon semiconductor layer; a P-type high concentration diffusion layer with a P-type impurity diffused therein at a high concentration; an N-type high concentration diffusion layer with an N-type impurity diffused therein at a high concentration; and a low concentration diffusion layer with one of the P-type impurity and the N-type impurity diffused therein at a low concentration. The P-type high concentration diffusion layer and the N-type high concentration diffusion layer are formed in the silicon semiconductor layer, and are arranged to face each other with the low concentration diffusion layer in between. The photodiode further includes an interlayer insulation film formed on the silicon semiconductor layer, so that a covalent bond between silicon and hydrogen is formed in an atom row of the low concentration layer adjacent to an interface thereof with respect to the interlayer insulation film.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: October 9, 2012
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Takashi Izumi
  • Patent number: 8280265
    Abstract: An image forming apparatus is provided with a developing unit for attaching developer to a static latent image formed through charging and exposing to form a developer image; an image supporting member for supporting the developer image formed with the developing unit; a removing member disposed to abut against the image supporting member for removing developer; a drive unit for driving the image supporting member; a drive control unit for controlling the drive unit; and a fixing unit for fixing the developer image to a medium. It is configured such that the drive control unit controls the drive unit to temporarily stop before developer is discharged.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: October 2, 2012
    Assignee: Oki Data Corporation
    Inventor: Masahiro Haruyama