Patents Represented by Attorney, Agent or Law Firm Kubovick & Kubovcik
  • Patent number: 7540538
    Abstract: A coupler joint (10) which includes a hollow cylindrical portion (11) opened at its opposite ends and a flange (12) disposed along the circumference of the cylindrical portion (11) near the longitudinal center to be interposed between a dialyzer connector (21) and a coupler (30) so as to be in liquid tight engagement; one side of the flange (12) of the coupler joint 10 being in liquid-tight abutment with an opening (22) of the connector (21) of the dialyzer (20), and the other side of the flange (12) being in liquid-tight abutment with the a seal surface 31 of the coupler (30). Accordingly, a dialysis solution does not collect in a concave groove (32) which accommodates an O-ring (40) of the coupler (30), and proliferation of bacteria can be prevented.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: June 2, 2009
    Assignee: Nipro Corporation
    Inventors: Shouichi Moriwaki, Makoto Mitsuhashi
  • Patent number: 6524711
    Abstract: A thermosetting resin composition comprising: a polycarbodiimide obtained from organic polyisocyanates containing at least one kind of aromatic polyisocyanate, an epoxy resin, a curing agent for epoxy resin, and a rubber component, wherein the proportions of the individual components are 100 parts by weight of the polycarbodiimide, 30 to 150 parts by weight of the epoxy resin, 1.0 equivalent or less, relative to the epoxy resin, of the curing agent for epoxy resin, and 0.1 to 20 parts by weight of the rubber component which is, in a semi-cured state (a B-stage), free from resin cracking or powder detaching when bent and therefore easy to handle and, after curing, has good electrical properties and heat resistance.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: February 25, 2003
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Patent number: 5945363
    Abstract: A silicon nitride sintered material includes silicon nitride and rare earth element compounds. Y and Yb are contained as the rare earth elements in a total amount of 5-7 mole % in terms of oxides, Yb/Y is 4/6 to 9/1 in terms of molar ratio of oxides, and the crystal phases of grain boundary contain a H phase and a J phase with the proportion of the H phase being larger than that of the J phase. A process for producing a silicon nitride sintered material includes the steps of mixing a Si.sub.3 N.sub.4 powder with Y.sub.2 O.sub.3 and Yb.sub.2 O.sub.3 both as a sintering aid, the total amount of Y.sub.2 O.sub.3 and Yb.sub.2 O.sub.3 being 5-7 mole % and the molar ratio of Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 being 4/6 to 9/1, molding the resulting mixture, sintering the molded material in a nitrogen atmosphere at 1,850-1,950.degree. C., and heat-treating the sintered material in air at 1,000-1,500.degree. C. for 0.5-10 hours.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: August 31, 1999
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasufumi Aihara, Katsuhiro Inoue
  • Patent number: 5792855
    Abstract: Water-absorbent resins which are prepared by mixing polysaccharides with amino acids (amino acids and/or polymers of amino acids) and heating the mixture so as to cause a crosslinking reaction therein. Each of the water-absorbent resins has a water-absorbing ratio of not less than 10 g/g with respect to physiologic saline as well as having a rate of biodegradability of not less than 10%. Moreover, its water-absorbing ratio under pressure is not less than 10 ml/g with respect to physiologic saline. The water-absorbing ratio under pressure is measured by using a measuring device that is constituted of a weighing machine, a container, an air-intake pipe, a conduit, a glass filter, and a measuring section. The water-absorbent resins are superior in both water-absorbing capacity and biodegradability, and are capable of maintain their water-absorbing capacity even under pressure.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: August 11, 1998
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Koichi Yonemura, Kazuhisa Hitomi, Akiko Mitsuhashi, Takaya Hayashi, Nobuyuki Harada