Patents Represented by Attorney Ladas & Larry LLP

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  • Ball grid array package with an electromagnetic shield connected directly to a printed circuit board
    Patent number: 6947295
    Abstract: A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receives the chip and the solder bumps therein, and a bottom opening for access into the inner space. The solder bumps project outwardly of the inner space through the bottom opening in the housing.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: September 20, 2005
    Assignee: Benq Corporation
    Inventor: Chia-Ming Hsieh