Abstract: A protected polymeric film comprises a polymeric film substrate having a first major surface and a second major surface opposite the first major surface, and a protective structure provided on at least the first major surface of the substrate, wherein the protective structure comprises a layer of boron oxide and an inorganic barrier layer. A protective structure may also be provided on the second major surface of the substrate. Organic electronic components may be formed on or attached to the protected polymeric films.
Type:
Grant
Filed:
June 11, 2008
Date of Patent:
December 23, 2008
Assignee:
3M Innovative Properties Company
Inventors:
Fred B. McCormick, Manoj Nirmal, George V. Tiers