Abstract: An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication of highly reliable semiconductor devices, The adhesive silicone sheet is produced by a very efficient method which yields an adhesive silicone sheet having particularly good adhesiveness. The siliocone adhesive sheet is used to produce highly reliable semiconductor devices in which the semiconductor chip has been bonded to its attachment site using the subject adhesive silicone sheet.

Abstract: To provides a hot-melt adhesive sheet that provides very precise bonding and a stress-relaxation capacity. Also, to provide highly reliable semiconductor devices in which the semiconductor element is bonded to its element attachment site using this hot-melt adhesive sheet. Hot-melt adhesive sheet that characteristically has hot-melt adhesive on both surfaces of the sheet and spacer within the sheet. Also, semiconductor device characterized in that the semiconductor element therein is bonded to its element attachment site by the above-described hot-melt adhesive sheet.

Abstract: A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25° C., wherein the aryl groups comprise from 1 to 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25° C. and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25° C.

Abstract: A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin consisting essentially of R33 SiO1/2 units and SiO4/2 units, wherein the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) 25 to 200 parts by weight of a silica filler having an average surface area less than 25 m2/g; and (E) a catalytic amount of a hydrosilylation catalyst. Each R3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups. The mole ratio of R33SiO1/2 units to SiO4/2 units in the organopolysiloxane resin is from 0.6:1 to 1.

Abstract: A compressible silicone composition formable from a silicone gel-forming composition and a hollow compressible filler which is adapted to be used in an electrically insulating seal. The compressible silicone composition comprises a mixture of organosilicon compounds which can crosslink to form a silicone gel and hollow compressible microspheres.

Abstract: A coating agent composition, comprising (A) 100 parts by weight of a polymer having at least two alkoxysilyl groups, wherein the polymer has a number average molecular weight of 500 to 500,000, the polymer has a principal chain comprising a polycarbonate or a polyarylate, and the alkoxysilyl groups in the polymer have the formula —SiR3−a(OR′)a, wherein R is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R′ is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms, and a is from 1 to 3; (B) 50 to 2,000 parts by weight of an organic solvent; (C) 1 to 90 parts by weight of an organosilane, wherein the organosilane is a compound having the formula R″eSiY4−e or a partially hydrolyzed condensate thereof, wherein R″ is a substituted or unsubstituted monovalent hydrocarbon group or a hydrogen atom, Y is a hydrolyzable group, and e is from 0 to 2; and (D) a cure catalyst in an amount sufficient to cure t

Abstract: wherein A is hydrogen or a residue afforded by the removal of n hydroxyl groups from an m-valent alcohol, each R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, each R1 is independently a divalent hydrocarbon group containing at least 2 carbon atoms, m and n are natural numbers wherein m≧n, p is 0 or 1, and Y is a phenol group having the formula: wherein R3 is alkyl and q is from 0 to 4. Also, a method of preparing a phenol-functional organosilicon compound.

Abstract: A silicone gel composition, (A) 100 parts by weight of a first polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule and having a viscosity of from 0.2 to 10 Pa·s at 25° C.; (B) at least about 0.5 part by weight of a second polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, wherein the second polydiorganosiloxane has a viscosity at 25° C. of at least four times the viscosity of the first polydiorganosiloxane at 25° C.; (C) an organohydrogensiloxane having the average formula R7Si(SiOR82H)3 wherein R7 is an alkyl group having 1 to 18 carbon atoms or aryl, R8 is an alkyl group having 1 to 4 carbon atoms, in an amount sufficient to provide from 0.1 to 1.5 silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; and (D) a hydrosilylation catalyst in an amount sufficient to cure the composition.

Abstract: A silacyclobutene compound having the formula: ##STR1## wherein R.sup.1 and R.sup.2 are independently chloro, triorganosiloxy, organooxy, triorganosilyl, or a monovalent hydrocarbon group; R.sup.3 is a monovalent hydrocarbon group free of conjugated aliphatic unsaturation or triorganosilyl; R.sup.5 is hydrogen or a monovalent hydrocarbon group free of conjugated aliphatic unsaturation; and R.sup.4 and R.sup.6 are independently hydrogen or a monovalent hydrocarbon group free of conjugated aliphatic unsaturation or together are an alkanediyl group, wherein the alkanediyl group and the carbon atoms to which it is attached form a carbocyclic ring having 4 to 7 carbon atoms; provided that R.sup.3 is not aryl. Methods of preparing the silacyclobutene compounds, silane polymers containing at least one silacyclobutene unit, and siloxane polymers containing at least one silacyclobutene unit.

Abstract: A silacyclobutane compound having the formula: ##STR1## wherein R.sup.1 and R.sup.2 are independently chloro, triorganosiloxy, organooxy, triorganosilyl, or a monovalent hydrocarbon group; R.sup.3 is a monovalent hydrocarbon group free of conjugated aliphatic unsaturation, triorganosilyl, or hydrogen; and R.sup.4 is a monovalent saturated hydrocarbon group; provided that when R.sup.3 is hydrogen, neither R.sup.1 nor R.sup.2 is chloro or organooxy. Methods of preparing the silacyclobutane compounds, silane polymers containing at least one silacyclobutane unit, and siloxane polymers containing at least one silacyclobutane unit.

Abstract: Silicone rubber composition comprising an alkenyl-substituted diorganopolysiloxane, an inorganic filler, an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, in a quantity that affords a value from 0.4 to 10 for the molar ratio of silicon-bonded hydrogen in the organopolysiloxane to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, an organohydrogenpolysiloxane, in a quantity that affords a value from 0.01 to 0.5 for the molar ratio of silicon-bonded hydrogen in this component to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, and a platinum catalyst.A fluororesin-covered fixing roll in which a fluororesin layer is placed over the circumference of a roll shaft with a silicone rubber layer interposed between the fluororesin layer and the roll shaft, wherein said silicone rubber composition is formed by curing the silicone rubber composition described above.

Abstract: A silicone composition comprising (A) 100 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 75 to 150 parts by weight of an organopolysiloxane resin having a number-average molecular weight of from 2,000 to 5,000 and consisting essentially of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, R.sup.4 is selected from the group consisting of R.sup.3 and alkenyl, the mole ratio of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.1:1, and the resin contains an average of from 2.5 to 7.

Abstract: A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin comprising R.sup.3.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups, the mole ratio of R.sup.3.sub.3 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.

Abstract: A hydroxyphenyl-containing silalkarylene compound having the formula: ##STR1## wherein R is a monovalent hydrocarbon group containing no aliphatic unsaturated bonds, R.sup.1 is alkylene having 1 to 10 carbon atoms, Ph is substituted or unsubstituted phenylene, A is substituted or unsubstituted hydroxyphenyl, B is alkylene having at least 2 carbon atoms or alkylenoxyalkylene, x is from 1 to 100, y is from 0 to 60, and a is 0 or 1. A silalkarylene-modified organic resin obtained by copolymerizing a hydroxyphenyl-containing silalkarylene compound with an organic resin monomer and a coating agent comprising a silalkarylene-modified organic resin.

Abstract: A method of preparing a coating agent, the method comprising the steps of (I) reacting (A) a polymer having at least two organic groups containing carbon-carbon unsaturated bonds with (B) an alkoxysilane containing a silicon-bonded hydrogen atom in an organic solvent and in the presence of a hydrosilylation catalyst to produce a solution containing an alkoxysilyl-functional polymer, wherein component (A) has a number-average molecular weight of 500 to 100,000 and has a principal chain comprise a polycarbonate or a polyallylate; and the alkoxysilane is an alkoxysilane having the formula H--SiR.sup.3.sub.3-a (OR.sup.4).sub.a or a partial hydrolyzate thereof, wherein R.sup.3 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, R.sup.

Abstract: Silicone rubber composition comprising an alkenyl-substituted diorganopolysiloxane, an inorganic filler, an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, in a quantity that affords a value from 0.4 to 10 for the molar ratio of silicon-bonded hydrogen in the organopolysiloxane to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, an organohydrogenpolysiloxane, in a quantity that affords a value from 0.01 to 0.5 for the molar ratio of silicon-bonded hydrogen in this component to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, and a platinum catalyst. A fluororesin-covered fixing roll in which a fluororesin layer is placed over the circumference of a roll shaft with a silicone rubber layer interposed between the fluororesin layer and the roll shaft, wherein said silicone rubber composition is formed by curing the silicone rubber composition described above.

Abstract: A silphenylene polymer having the general formula: ##STR1## wherein each R is independently a monovalent hydrocarbon group free of aliphatic unsaturation and having 1 to 10 carbon atoms; Ph is a substituted or unsubstituted phenylene group; R.sup.1 is an alkylene group having 2 to 10 carbon atoms or an alkyleneoxyalkylene group; A is a hydrolyzable group or a hydroxy group; B is an alkylene group having 2 to 10 carbon atoms, an alkyleneoxyalkylene group, or an oxygen atom; n is an integer from 0 to 2; x is an integer having a value of at least 1; y is an integer having a value of at least 0; and z is an integer having a value of at least 0.

Abstract: A 1-acyloxy-organotetrasiloxane represented by the general formula: ##STR1## wherein R.sup.1 is a monovalent organic group containing an acryloyloxy group or a monovalent organic group containing a methacryloyloxy group, and R.sup.2 is a monovalent hydrocarbon group, and a process for producing the above mentioned 1-acyloxy-organotetrasiloxane, which is characterized by subjecting hexamethylcyclotrisiloxane to a ring-opening reaction with an acyloxysilane represented by the general formula: ##STR2## wherein R.sup.1 is a monovalent organic group containing an acryloyloxy group or a monovalent organic group containing a methacryloyloxy group, and R.sup.2 is a monovalent hydrocarbon group, in the presence of an acidic catalyst.

Abstract: The present invention provides a heat-conducting polymer composition in which a heat-conducting metal powder is contained in a polymer, said heat-conducting polymer composition being characterized by the fact that the aforementioned powder is a metal powder which has a metal oxide layer and/or a metal nitride layer on the surfaces of the powder particles. The heat-conducting polymer composition of the present invention is characterized by the fact that said composition has a superior storage stability and thermal conductivity, and also by the fact that said composition has electrical insulating properties.

Abstract: A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group containing organopolysiloxane such that when the compositon is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the compositon, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.