Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
Type:
Grant
Filed:
January 10, 2001
Date of Patent:
February 4, 2003
Assignee:
International Business Machines Corporation
Inventors:
Marshall L. Brown, James A. Busby, Raymond A. Phillips, Jr., John A. Potenza, Jirina D. Shupp, J. Robert Young
Abstract: A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. A reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. The mask and excess solder paste are removed.
Type:
Grant
Filed:
June 12, 2001
Date of Patent:
February 4, 2003
Assignee:
International Business Machines Corporation