Abstract: Methods of forming continuous layers on regions of a substrate are described. Generally, an imprint lithography template may contact liquid positioned on the substrate. The liquid may be cured forming a masking layer, and the imprint lithography template separated from the masking layer. Prior to separation, pressurized gas and/or vacuum may be applied between the template and the substrate. Additionally, during separation, pressurized gas and/or vacuum may be applied between the template and the substrate.

Abstract: Systems to control an atmosphere about a substrate are described. The systems include a wall coupled to the substrate to create a resistance of the flow between different regions of the substrate.

Abstract: A layer on a substrate is formed using an imprint lithography system. The layer is formed by providing a plurality of flowable regions on the substrate, spreading material in the flowable regions, and contacting the regions with a plurality of imprint lithography molds that are disposed on a template.

Abstract: The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through capillary action between the conformable material and one of the mold and the substrate. Thereafter, the conformable material is solidified. Specifically, the distance between the mold and the substrate is controlled to a sufficient degree to attenuate, if not avoid, compressive forces between the mold and the substrate. As a result, upon initial contact of the mold with the conformable material, spontaneous capillary filling of the volume between the mold and the substrate occurs.

Abstract: A method for spreading a conformable material between a substrate and a template having a mold. The method comprises positioning the mold to be in superimposition with the substrate defining a volume therebetween. A first sub-portion of the volume is charged with the conformable material through capillary action between the conformable material and one of the mold and the substrate. A second sub-portion of the volume is filled with the conformable material by creating a deformation in the mold.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: An imprint lithography template including, inter alia, a body having a first thickness associated therewith; a patterning layer, having a second thickness associated therewith, comprising a plurality of features, having a third thickness associated therewith.

Abstract: Methods of patterning a substrate including creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions are described. A polymerizable material composition is dispense on the patterned layer defining a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.

Abstract: A method for detecting a particle between a nanoimprint mold assembly and a substrate in a nanoimprint lithography system.

Abstract: A transparent imprint template mold is configured with gratings surrounding the active imprint area. The gratings are fabricated at the same time as the active area and thus accurately define the active area with respect to the gratings. The substrate is positioned in tool coordinates under the template mold. A sensor system generates a beam of optical energy and receives reflected energy only at a specific angular window and is used to locate the template mold. The sensor system is scanned to locate the substrate and the gratings in tool coordinates. In this manner, the relative position of the template mold is determined with respect to the substrate in tool coordinates. The substrate is then accurately positioned with respect to the template mold. The system may be used to track imprinted pattern position relative to the substrate and to determine concentricity of patterns to substrates.

Abstract: Defects and/or particles during an imprint lithography process may provide exclusion zones and/or transition zones in the patterned layer. Exclusion zones and/or transition zones in the patterned layer may be identified to provide a region of interest on a template.

Abstract: A method of depositing material upon a substrate features filling recesses of a substrate with liquid and removing material present on the substrate, outside of the recesses using fluid, i.e., apply a vacuum of a jet of fluid. To that end, one method of the present invention includes depositing a measure of liquid upon a surface of a substrate having a recess formed therein to ingress into a volume of the recess with a portion of the liquid. A quantity of the liquid is disposed upon regions of the surface proximate to the recess. Thereafter, the quantity of liquid is removed while maintaining the portion within the volume. In this manner, the portion may be transferred onto an additional substrate. More specifically, the portion may be placed in contact with a layer of flowable material and cross-linking therewith by exposing the liquid and the flowable material to actinic radiation.

Abstract: The present invention provides a method for separating a mold from solidified imprinting material that includes creating deformation in the template in which the mold is included. The deformation is sufficient to create a returning force that is greater than an adhesion forced between the solidified imprinting material and the mold. For example, the deformation may result from a pressure differential created between the mold and a side of the template disposed opposite to the mold. In this manner, the distortion may be undulations in the template of sufficient magnitude to contact a substrate upon which the solidified imprinting material is disposed.

Abstract: The present invention is directed towards several aspects of imprint lithography that have to be improved to address imprinting of partial fields and dies at the edge of the wafer.

Abstract: The present invention is directed towards a chucking system, including, inter alia, a body having a surface with a pin extending therefrom having a throughway defined therein, and a land surrounding the protrusions defining a channel between the pin and the land. In a further embodiment, the body comprises a plurality of protrusions.

Abstract: Fabricating a cross-point memory structure using two lithography steps with a top conductor and connector or memory element and a bottom conductor orthogonal to the top connector. A first lithography step followed by a series of depositions and etching steps patterns a first channel having a bottom conductor. A second lithography step followed by a series of depositions and etching steps patterns a second channel orthogonal to the first channel and having a memory element connecting the an upper conductor and the lower conductor at their overlaid intersections.

Abstract: An imprint lithography system operable for imprinting a pattern into a material deposited between an imprint mold and a substrate, the system including, inter alia, a first set of imaging units positioned at a first angle relative to normal of the substrate; and a second set of imaging units positioned at a second angle relative to normal of the substrate, wherein the first and second angles are not equal to each other.

Abstract: An improved lithographic alignment method, system, and template. The method includes creating, within a lithographic subfield, subsequent-layer features which are intentionally offset from their respective previous-layer features, where the intentional offset may vary in magnitude and direction from one subfield to the next. The system includes an imprint lithographic machine and first and second lithography templates where the templates are adapted to enable the machine to form first and second features, respectively, and where a second feature is configured to be deliberately offset from a corresponding first feature. The template set includes at least two templates, one having features which are deliberately offset from corresponding features of another template. Also, a method of manufacturing such a template set.

Abstract: A method of patterning a substrate comprising first and second fields with a template, the template having a mold and a plurality of alignment forming areas and a plurality of template alignment marks, the method comprising: positioning a material on the first field of the substrate and a plurality of regions of the substrate, the plurality of regions laying outside of the first and second fields; positioning the mold and the substrate such that a desired spatial relationship between the mold and the first field of the substrate is obtained to define a pattern in the material on the first field of the substrate while concurrently defining a plurality of substrate alignment marks with the material in the plurality of regions of the substrate in superimposition with the plurality of alignment forming areas of the template; positioning a material on the second field of the substrate; and positioning the mold and the substrate to obtain a desired spatial relationship between the plurality of template alignment ma

Abstract: The present invention is directed towards a method for determining deformation parameters that a patterned device would undergo to minimize dimensional variations between a recorded pattern thereon and a reference pattern, the method including, inter alia, comparing spatial variation between features of the recorded pattern with respect to corresponding features of the reference pattern; and determining deformation forces to apply to the patterned device to attenuate the dimensional variations, with the forces having predetermined constraints, wherein a summation of a magnitude of the forces is substantially zero and a summation of moment of the forces is substantially zero.