Abstract: A purge head is provided for use with an integrated circuit test system to direct purge gases, such as nitrogen, to a circuit board on which a device under test is mounted while the device is subjected to below freezing temperatures. The purge head fits into the inner ring or aperture of the product load board to dispense the purge gases directly onto the circuit board on which the device under test is mounted to prevent moisture buildup during cold testing of the device under test.