Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned at an angle away from the probe base and is held in its angled position with respect to the probe base by a probe holder and a probe clamp. Upper and lower cantilever springs are positioned within a hollowed portion of the probe base, and provide a spring return of the probe when a push button is released from its depressed position. A spacer is provided between the upper and lower cantilever springs.