Abstract: An apparatus and method integrates optical transceivers for transfer of signals between optical and electronic media with surface mount packages, such as ball grid arrays and quad flat packs. A surface mount package is positioned directly beneath a modular optical transceiver. The surface mount package provides for electrically coupling external signals to the optical transceiver, so as to allow full performance functionality of data transfer components. An electrical coupling mechanism with high performance at high frequency is positioned between the surface mount package and the optical transceiver, electrically connecting them. In one implementation, the optical transceiver module is mounted directly to said surface mount package such that it is removable. In one embodiment, heat dissipation is provided by integral components and thermal vias, in addition to heat sinks.