Patents Represented by Attorney Ledig, Voit & Mayer, Ltd.

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  • Circuit device and method of manufacturing the circuit device
    Patent number: 7125788
    Abstract: A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: October 24, 2006
    Assignee: TDK Corporation
    Inventors: Takaaki Domon, Toshiyuki Nagatsuka, Tsutomu Yasui, Ryoichi Kondo
  • Power module
    Patent number: 6509629
    Abstract: A control substrate is covered by an electromagnetic shielding member connected to a conductive base plate on which a power insulating substrate is placed. A conductive connecting member through which the electromagnetic shielding member and the conductive base plate are electrically connected to each other is inserted into a case. The control substrate and the electromagnetic shielding member are supported by the conductive connecting member.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: January 21, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Naoki Yoshimatsu, Takanobu Yoshida
  • Dog biscuit
    Patent number: D429867
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: August 29, 2000
    Assignee: Pet Life Foods, Inc.
    Inventor: William James Heaton