Abstract: Complexes of a selected class of chiral ligands with molybdenum, tungsten or chromium, preferably molybdenum, are effective as catalysts in highly enantioselective and regioselective alkylation of allylic substrates. Such compositions provide a versatile and low-cost alternative to existing catalysts.

Abstract: Disclosed are compositions and methods for promoting plant growth. The compounds are cyclopropyl- and cyclobutyl-substituted brassinosteroids having high growth promoting ability. They may be used alone or in combination with other plant growth regulating agents.

Abstract: Polymeric compositions effective for delivering compounds in living organisms are described. The compositions include polypeptides which exhibit solubility in both hydrophilic and lipophilic environments by undergoing a reversible pH-dependent transition from a low-pH, lipophilic form to a high-pH, hydrophilic form.

Abstract: A process for hot or supercritical water oxidative decomposition of wastes, particularly halogenated organic compounds, is described. The process employs a heterogeneous reagent which accelerates the decomposition and is effective to neutralize acidic byproducts. The reagent is maintained in suspension throughout the reaction by operating at conditions of temperature and pressure at which the heterogeneous reagent is largely or fully insoluble in water, and preferably at which liquid water is not present. Production of potentially corrosive brine is also minimized by operating at conditions under which sodium chloride is insoluble.

Abstract: A method of purifying a hydrophobically substituted polynucleotide by reverse phase HPLC is described. The hydrophobic substituent may be removed from the polynucleotide under non-acidic conditions; the purification method is thus especially useful for acid sensitive polynucleotide analogs.

Abstract: An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant parallel and coaxial alignment between the rotating polishing plates.