Abstract: An EMI/RFI shield for gaps in cases of electronic systems is disclosed that includes a case, a component mounted on the case, and a string positioned between the component and the case. The string includes a longitudinal element and a plurality of conductive filaments transversely mounted on the longitudinal element. The invention also contemplates a method of reducing radiation from a case housing at least one electronic component and having an opening formed therein with a perimeter. The method includes positioning a string having transverse conductive filaments along at least a portion of the perimeter of the opening, and installing the electronic component adjacent to the opening in the case with the string being positioned between the component and the case adjacent to the perimeter of the opening.