Abstract: An information processing apparatus which may include basic-file management means for managing a file stored in a storage medium by utilizing basic-file management information stored in the same storage medium, specific-file management means for managing a specific type file in files which are adapted to share predetermined management-use information items out of management-use information items set to each file owned by the basic-file management means, and which are managed by the basic-file management means by utilizing specific-file management information stored in the storage medium, comparing means for comparing, when performing an index display in which the specific type file to be stored in the storage medium is displayed in an index style, a content of the management-use information item, about the specific type file to be displayed in the index display, shared by the basic-file management information and the specific-file management information, and display controlling means for executing the index d

Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.

Abstract: A method of connecting a substrate to a semiconductor chip and component therefor to allow for the packaging of a chip even after successive die shrinks. The method compensates for successive die shrinks by providing a substrate that has connection sections of electrical leads that are releasable and/or be displaceable from a surface of the substrate as a result of a force from a bonding tool on the connection sections through at least one substrate aperture. A contact bearing surface of a semiconductor chip may then be aligned with the substrate so that the connection sections are in general alignment with the chip contacts. The connection sections may then be displaced and bonded to respective chip contacts. Other methods may be used to ensure that the chip, after die shrink, fits within the same package such as aligning the chip asymmetrically with the substrate and designing the location and dimensions of the substrate apertures so that the connection sections can be in alignment with the chip contacts.