Abstract: A process for forming a photoresist image on a substrate and a process for forming metal contacts on a substrate are described.

Abstract: A process for forming a nanoporous dielectric silica coating on a surface of a substrate. The process includes spin-depositing alkoxysilane composition onto a surface of a substrate; spin depositing a surface hydrophobizing agent or a solvent onto an edge portion of the substrate to thereby remove the alkoxysilane composition from that area; and then curing the alkoxysilane composition to form a nanoporous dielectric silica coating. In another embodiment, an alkoxysilane composition layer is deposited onto a surface of a substrate. Then a solvent for the alkoxysilane substantially removes a portion of the alkoxysilane layer on the edge portion of the surface. This results in a transfer or cascading of a quantity of the alkoxysilane from a region adjacent to the edge portion to form a relatively thinner layer of the alkoxysilane onto the edge portion of the substrate surface. Then the relatively thinner alkoxysilane layer is removed prior to curing the alkoxysilane.

Abstract: The invention relates to nanoporous dielectric films and to a process for their manufacture. Such films are useful in the production of integrated circuits. Such films are produced from a precursor of an alkoxysilane; a relatively low volatility solvent composition comprising a e C.sub.1 to C.sub.4 alkylether of a C.sub.1 to C.sub.4 alkylene glycol which is miscible in water and alkoxysilanes, having a hydroxyl concentration of 0.0084 mole/cm.sup.3 or less, a boiling point of about 175.degree. C. or more at atmospheric pressure and a weight average molecular weight of about 120 or more; a relatively high volatility solvent composition having a boiling point below that of the relatively low volatility solvent composition; optional water and an optional catalytic amount of an acid.

Abstract: The invention relates to the formation of structures in microelectronic devices such as integrated circuit devices by means of borderless via architectures in intermetal dielectrics. An integrated circuit structure has a substrate, a layer of a second dielectric material on the substrate and spaced apart metal contacts on the second dielectric. A space between adjacent metal contact side walls is filled with the second dielectric material. A ledge of a first dielectric material is on top of each second dielectric material filled space. The ledges are attached to adjacent side walls such that each ledge either fully spans the width of the filled space between adjacent side walls; or partially spans the width of the filled space between adjacent side walls, and the area between adjacent ledges is filled with second dielectric material. A top surface of each of the metal contacts, a top surface of the ledges and a top surface of any filled areas between adjacent ledges are at a common level.

Abstract: The invention relates to nanoporous dielectric films and to a process for their manufacture. Such films are useful in the production of integrated circuits. Such films are produced from a precursor of an alkoxysilane; a relatively low volatility solvent composition comprising an ether of a C.sub.1 to C.sub.4 alkylene glycol which is miscible in water and alkoxysilanes, having a hydroxyl concentration of 0.021 mole/cm.sup.3 or less, a boiling point of about 175 .degree. C. or more at atmospheric pressure and a weight average molecular weight of about 100 or more; a relatively high volatility solvent composition having a boiling point below that of the relatively low volatility solvent composition; optional water and an optional catalytic amount of an acid.

Abstract: A process for the preparation of substrates used in the manufacture of integrated circuits wherein spin-on low dielectric constant (low-k) polymer films are applied on semiconductor substrates. A non-etchback processing of spin-on low-k polymer films, without losing the low dielectric constant feature of the film, especially in between metal lines, is achieved utilizing electron beam radiation. A polymeric dielectric film is applied and dried onto a substrate and exposed to electron beam radiation under conditions sufficient to partially cure the dielectric layer. The exposing forms a relatively more hardened topmost portion of the dielectric layer and a relatively less hardened underlying portion of the dielectric layer.

Abstract: A process for forming a nanoporous dielectric coating on a substrate. The process follows the steps of blending an alkoxysilane with a solvent composition and optional water; depositing the mixture onto a substrate while evaporating at least a portion of the solvent composition; placing the substrate in a sealed chamber and evacuating the chamber to a pressure below atmospheric pressure; exposing the substrate to water vapor at a pressure below atmospheric pressure and then exposing the substrate to base vapor.

Abstract: Nanoporous silica dielectric films are modified by electron beam exposure after an optional hydrophobic treatment by an organic reactant. After formation of the film onto a substrate, the substrate is placed inside a large area electron beam exposure system. The resulting films are characterized by having a low dielectric constant and low water or silanol content compared to thermally cured films. Also, e-beam cured films have higher mechanical strength and better resistance to chemical solvents and oxygen plasmas compared to thermally cured films.

Abstract: A process for forming a nanoporous dielectric coating on a substrate. The process includes either (i) combining a stream of an alkoxysilane composition with a stream of a base containing catalyst composition to form a combined composition stream; immediately depositing the combined composition stream onto a surface of a substrate and exposing the combined composition to water (in either order or simultaneously); and curing the combined composition; or (ii) combining a stream of an alkoxysilane composition with a stream of water to form a combined composition stream; immediately depositing the combined composition stream onto a surface of a substrate; and curing the combined composition.

Abstract: A process for the manufacture of nanoporous silica dielectric films by vapor deposition of silica precursors on a substrate. The process provides for vaporizing at least one alkoxysilane composition; depositing the vaporized alkoxysilane composition onto a substrate; exposing the deposited alkoxysilane composition to a water vapor, and either an acid or a base vapor; and drying the exposed alkoxysilane composition, thereby forming a relatively high porosity, low dielectric constant, silicon containing polymer composition on the substrate.

Abstract: In a multi-color imaging apparatus utilizing a recharge step between two image creation steps, a corona generating device is used to recharge the developed image areas and untoned areas of a charge retentive surface to a lower electrical potential than that associated with the developed image areas before recharge, so that the residual voltage associated with the developed image is substantially reduced and a minimal level of negative charge is driven through the toner layer(s). An electrical charge associated with any previously developed images is substantially neutralized prior to development of any subsequent images thereon.

Abstract: A monolithic array of two or more independently addressable, closely spaced diode lasers having low thermal, electrical, and optical crosstalk. An isolation groove is formed between the adjacent laser elements, which are defined by rib loaded waveguides created by etching mesas above a planar active multilayer waveguide. Separate electrical connections to the ribs, and a common electrical connection to the substrate, enable individual addressing of each laser element. Selectively added blocking layers and/or insulating layers are added to the structure to provide improved electrical and/or thermal isolation.

Abstract: A roller for increasing the rate of permeability of liquid carrier from an image formed from a liquid developer comprised of toner particles and liquid carrier. Perforations formed through the skin covering of the blotter roller provide high quality transfer of an image having maximum toner particles and minimal liquid carrier to a final copy sheet, at an increased process speed.

Abstract: An agglomerate spot cleaning blade is supported to cleaning housing, thereby forming a substantially enclosed chamber, in sealing engagement with respect to the photoreceptor surface. Contact is maintained between a cleaning brush, located within a cleaning housing, and a blade, whereby rotating brush fibers remove accumulated agglomerate debris particles from the blade. A substantially air-flow free environment is maintained for removal of residual toner and debris from the photoreceptor surface and the blade, without the need for a separate vacuum/air removal system assist, or a separate manual maintenance step.

Abstract: A thin scraper blade member is arranged in interference with, and at a low angle of attack with respect to the photoreceptor so that a maximum shearing force can be applied by the blade to the spot-causing agglomerate particles for removal thereof. A slit extends laterally from one side of the blade and parallel to the edge of the blade, so that blade tuck occurrence is minimized. The slits serve to reduce the load and eliminate forces on the ends of the blade that cause the blade to tuck under. The slit also improves the range of tolerance of interference of the blade surface with respect to the photoreceptor surface before blade tuck occurs. A relatively low load is applied to the blade, so that the problems associated with the frictional sealing contact that must occur in the normal cleaning engagement of blades with a charge retentive surface are avoided.