Abstract: A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.
Type:
Grant
Filed:
July 31, 2002
Date of Patent:
February 24, 2004
Assignee:
Hewlett-Packard Development Company, L.P.
Inventors:
Brent A. Boudreaux, Stacy Fraker, Eric C. Peterson, Christian L. Belady