Abstract: Fluid, such as air, flowing through a duct is sampled by a detector in a chamber by withdrawing a portion of the fluid from the duct by an impact tube which connects the duct to an inlet in the sampling chamber. Several openings in the impact tube extend across the duct and face into the direction of fluid flow in order to obtain a cross-sectional and representative sample of the fluid. To insure that an adequate sample is obtained, one or more venturi tubes are also placed into the direction of the flow path of the fluid and these venturi tubes are connected to the outlet of the sampling chamber to exert a pressure in the chamber which is negative with respect to the chamber inlet from the impact tube.

Abstract: A selected number of heat pipes, located in the front rows of a plurality of otherwise operable heat pipes which are disposed between intake and exhaust ducts, have liquid-trap sections extending into a switching section. During normal operation, reservoirs in the switching section are dry and the plurality of heat pipes operate in a conventional manner. However, if some of the heat pipes in the exhaust dust become frosted over or otherwise too greatly cooled due to excessive cold in the intake duct, thermostatically or command-controlled valves or louvres cause the fluid stream in the exhaust duct to warm up or defrost the excessively cooled heat pipes therein. Prevention of excessive cooling is used to avoid frost build-up in air conditioning equipment, or solidification of solids and condensation of corrosive liquids.

Abstract: Electrical pin and socket contacts, contained within connectors and interconnectable with one another by mating connection of the connectors, are sealed from the environment external to the interior of the connectors and the connection therebetween regardless of changing pressure conditions. Individual pressure-sensitive wire seals are utilized for each contact at the rear of the connectors and a two sided pressure-sensitive interface seal is utilized for sealing between two mating connectors. The pressure-sensitive wire seal at the rear of each connector includes a tubular portion jacketed in sealing contact on the conductor insulation, a cup-shaped flange opening toward the rear of the connector, a wiper land inwardly disposed of the cup-shaped land, and an interlocking engagement between the seal and the wire-receiving end of the contact.

Abstract: Flexible or conventional wire cables are terminated and interconnected at connectors with only a pressure type contact. Two cable terminations are fabricated from identically chemically milled thin metallic wafers, in which one wafer is plated with metallic buttons. The two wafers are placed opposing each other and pressed between pressure plates with contact made only by the buttons. The plastic memory of the buttons is used as a spring, which is correlated with the force applied by the opposing plates.

Abstract: High atomic number metals or compounds are used as electron beam registration alignment marks on low atomic number substrates; this combination produces enhanced secondary and backscattered electron video signals over topographical alignment marks of homogeneous materials. To augment the enhanced signal contrast, pairs of alignment marks are placed very close together (less than or equal to 3 micrometers), from which the gap between the pair produces the augmented, enhanced signal contrast. In particular, the backscattered electron signal is enhanced when detected with an energy sensitive collector such as a silicon diode detector.

Abstract: Heat pipe technology may be utilized to cool circuit card-mounted electronic components. A heat pipe thermal mounting pipe has a very high thermal conductivity and provides a relatively uniform temperature surface for attaching of circuit card-mounted electronic components. It comprises thin evaporator and condenser wicks (for low temperature gradients) as well as a relatively porous sintered metal artery wick (for high heat transfer capability). The heat sink or other heat exchanger may be mounted at the edge of the thermal mounting plate in the vicinity of the condenser wick. The electronic components are mounted in the vicinity of the evaporator wicks.

Abstract: A generally C-shaped or .OMEGA.-shaped elongated clamp secures a flexible circuit or flat cable to the edge of a circuit board designed for use in electronic watches, calculators, combinations thereof and like small devices such as are wearable on the user's wrist.

Abstract: An electronic device, e.g., a quartz crystal in an enclosure having three stubby leads for use in an electronic watch, is mounted adjacent to a substrate having three feedthrough holes near its perimeter. Connection between the substrate and the three stubby leads are made simultaneously by three individual connection devices all attached to a tab through individual breakaway neck portions. Each connection device comprises a tail which is forked for insertion by interference fit into the feedthrough holes in the substrate. At the opposite end from the tail is a keyhole opening, in which the larger hole fits over one of the stubby leads and in which a smaller hole can be slid onto the lead by a force fit. Thus, in operation, the bifurcated tails of each device are placed through the feedthrough holes and the keyhole openings of each device are placed over their respective stubby leads.

Abstract: A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.

Abstract: A plunger placed through an opening in a heat pipe enclosure is heated to a temperature above the saturation temperature of the working fluid in the heat pipe to prevent the fluid from condensing across the gap between the plunger and the opening and to allow non-condensible gases to escape. Thereafter, the plunger is melted to seal the heat pipe. The plunger and at least that part of the heat pipe with the opening therethrough are made from the same materials.

Abstract: A pin tumbler cylinder lock having a plug rotatable within an external housing, the housing and plug having a row of axially aligned locking bores, a key slot in said plug in alignment with the bores, the lock bores having space for springs, wafers and locking tumbler pins positioned and sized to permit the plug to be operated with a predetermined operating key to lock and unlock the lock when the operating key is inserted into the slot; the housing having a row of auxiliary aligned bores angularly offset from the locking bores, the auxiliary bores having springs and master wafers, the springs biasing the master wafers inwardly toward the plug; and the improvement comprising a relatively thin-walled shutter sleeve fitted for rotation around the plug, the plug being adapted to rotate within the shutter and/or therewith, a row of axially aligned locking bores in said shutter in respective radial and axial alignment with the locking bores in the housing and the plug; first means within the housing and the shutte

Abstract: An assembly and method for mounting a transistor chip on a carrier with lead attachment allows a circuit to approach the limitations of the transistor chip rather than to be limited by the transistor package and attached leads. The carrier is provided with a groove into which the transistor chip is placed so that the surface thereof defining the emitter is flush with a surface of the carrier. A wide but short ribbon lead is bonded from the emitter to the adjacent flush surface of the carrier so that both the characteristic impedance and the wire length are decreased to minimize the value of emitter inductance.

Abstract: A crimp type contact having a wire wrap post secured thereto is prevented from rotating within an insulation block when a conductor is wrapped around the post by a small stamped sheet metal spur attached to the contact which is so configured that, when the contact is installed into its cavity in the insulation body, the spur bites into the walls of the cavity.

Abstract: A heat pipe extends into the path of flow of a viscous fluid, e.g., polymer, for transferring heat from or to the flowing fluid and thereby for solidifying and stopping flow of the fluid or, conversely, for melting the solidified matter for resumed flow thereof. Control may simply increase or decrease the fluid viscosity for varying the rate of flow.

Abstract: A flat pack or a platform type ceramic-metal package for housing large scale integrated (LSI) circuit wafers or hybrid circuits comprises a rectangular, square or circular, flat ceramic base metallized with a pattern of radial leads from the central portion of the package to its periphery. The leads pass out underneath a ceramic ring frame hermetically sealed to the base. The outside of the ring frame is metallized. Alternatively, flat-headed metal pins may be passed through the base. Hermetically brazed to the frame is a Kovar ring or sleeve. The electronic device is bonded inside the ring frame to the package base. Electrical connections from wafer or hybrid circuit pads to lead pads or pins within the ring frame are made by conventional wire bonding techniques. A ceramic lid with rim and the outer portion of its upper surface metallized is attached to the package by soldering to the Kovar ring.

Abstract: Large bulk single crystals of lead tin telluride are synthesized by first mixing desired amounts of lead, tin and tellurium with, if desired, bismuth and reacting the mixture at 950.degree. C to form a source material. The source material is then converted into a single crystal by recrystallization and digestion in a uniform 850.degree. C to 860.degree. C temperature zone in order to prevent transport of material and, hence, variations in composition. Thereafter, these crystals, which are doped with bismuth, or crystals made by Bridgman or Czochralski growth, are cut into wafers and isothermally annealed at 600.degree. C to 650.degree. C under a metal-rich vapor pressure obtained from metal-rich lead tin telluride powder. Lowering of temperature to about 200.degree. C and further annealing is capable of converting p-type crystals to n-type crystals. The result of annealing, whether p-type, n-type, or intrinsic, is a low carrier concentration, high mobility crystal.

Abstract: A housing has a threaded bore opening to an inlet and an outlet. The outlet axis is substantially perpendicular to the bore axis while the inlet axis is off-center from the bore axis. A plug in the housing bore comprises three cylindrical portions which are threaded in the housing bore and which are joined together but spaced apart by perforate cylindrical support tubes of lesser diameter than the threaded portions. A screen mesh extends about each support tube. Bores extend radially through two of the threaded cylindrical portions and only one at a time is alignable with the housing outlet, depending upon the threaded position of the plug in the housing bore. Accordingly, molten plastic material enters into the bore from the off-center housing inlet which urges the plastic material around the exterior of the screen to limit clogging and to extend screening life.

Abstract: A plurality of parallel heat pipes extends between supply and exhaust ducts leading to and from an industrial or habitable enclosure. The heat pipes are mounted on, but at a fixed angular offset from, an axis about which they can be angularly rotated within the exhaust and supply ducts. Their mounting is also at an angular inclination to gravitational force to assure unidirectional operation. In this arrangement, the heat input is into the lower side of the heat pipes for proper operation. For two-season operation, rotation of the heat pipes by 180.degree. ensures that the lower side of the heat pipes will always be in the warmer duct, whether exhaust or supply. Temperature control of incoming air is obtained by slight angular rotation of the heat pipes so that a part of each air stream in the exhaust and supply ducts bypasses the heat pipes. Defrost control is also obtained by a similar slight angular rotation of the heat exchanger, although a complete 180.degree.

Abstract: The emitter-valve includes a deformable element placed within a cavity. The element has a stem which extends within a water inlet to the cavity or a base which rests on the inlet wall on the bottom of the cavity so that, upon supply of water, the element deformably moves upward against a wall having a water outlet therein to permit water to flow to soil. A groove across the element top cooperates with an annular protuberance on the water outlet wall so that, as water pressure rises, water flow decreases and, as water pressure decreases, water flow increases. Further included are three deformable fingers of springy material which normally space the element from the water outlet and which briefly resist upward movement of the element and contact of the groove with the annular protuberance upon initial water turn-on to permit the water to spurt through the valve outlet and to carry therewith any lodged solid particulate matter.

Abstract: A multi-spline tool cuts material from the interior wall of a heat pipe envelope to provide a path for working fluid flow. Cross cuts can be made by pulling the tool out of the same end from which it was inserted while the tool continues to rotate in the same direction. An unrestrained liquid supply artery configured, for example as a cylinder of perforated metal, wire screen material, or other porous substance, with a designed flow area is inserted in the envelope. Since the artery is unrestrained, that is, not attached to the envelope, in a gravity field it will drop to the lower portion of the envelope inside diameter to assure a liquid flow at the bottom of the tube, regardless of the orientation of the heat pipe.