Abstract: A process for controlling the etch of a silicon dioxide layer at a high etch rate and high selectivity with respect to silicon nitride, particularly in a multilayer structure, by maintaining various portions of the etch chamber at elevated temperatures.
Type:
Grant
Filed:
November 15, 1993
Date of Patent:
March 9, 1999
Assignee:
Micron Technology, Inc.
Inventors:
David S. Becker, Guy T. Blalock, Lyle D. Breiner
Abstract: Electron emitters and a method of fabricating emitters which have a concentration gradient of impurities, such that the highest concentration of impurities is at the apex of the emitters, and decreases toward the base of the emitters. The method comprises the steps of doping, patterning, etching, and oxidizing the substrate, thereby forming the emitters having impurity gradients.