Abstract: A trench for isolating active devices on a semiconductor substrate, formed by creating a trench which has a peripheral edge, and disposing an isolating material in the trench. The isolating material extends over the peripheral edge of the trench, thereby covering at least a portion of the substrate surrounding the trench, and substantially limiting leakage of the active devices disposed on the substrate.
Type:
Grant
Filed:
February 11, 1997
Date of Patent:
February 9, 1999
Assignee:
Micron Technology, Inc.
Inventors:
Pierre C. Fazan, Martin C. Roberts, Gurtej S. Sandhu