Abstract: A device and a method which utilizes semi-interpenetrating polymer networks for strain relief of fiber or cable. The need for adhesives and mechanical means for cable or fiber retention is eliminated while performance and reliability is enhanced. In one embodiment a first polymer network is fabricated in an undersized plug which is in turn placed inside a hollow connector housing with an open end and at least one aperture for a cable to pass through. The void created between the plug and the connector shell is then subsequently filled by adding a second polymer to fill the unit. The unit is then placed in a curing chamber so that the polymer can swell and completely fill any voids between the plug and the connector shell.

Abstract: A system for providing distributed control of a resource with centralized configuration management. A network of distributed workstations is provided for controlling a resource such as a large mainframe computer. Server workstations for applying control commands to the resource are attached to each resource, preferably through redundant connections. Remote client consoles are defined which may be connected to the server for control of that resource. Server and resource location and primary and fallback connection paths are maintained by a centralized control server. Upon client console request, the central control server causes the server workstation associated with a particular resource to establish a control session between the server and the client console. A record of each dynamic connection is maintained by the central control server. Upon failure of a client console, the server accesses central server fallback information and establishes a fallback connection with an operational client console.

Abstract: A system and method for logical console verification and fallback. Conformity of physical equipment configurations with the logical console control and fallback plan is verified by sending messages through the backup paths and testing message response. The method of resource server or logical console fallback to a backup resource server or logical console includes the steps of verifying operational status of each physical component defined by the logical configuration description to assure availability. Tests can be manually or automatically generated. If all tests are completed successfully, resource server or console fallback is initiated.

Abstract: A system and method for establishing a passive recovery environment for an operating system kernel. A cross reference between an instruction address range and recovery routine address is established during binding of the kernel. Normal process initiation and termination includes no recovery overhead. In the case of system failure, the failing instruction address is used to access the recovery routine cross reference tables to determine recovery routine address. The error detection process then initiates recovery routine processing.

Abstract: A device and method for cryogenic cooling of electronic components. A mixture of a first non-condensible gas and a second condensible gas is provided within an insulative housing. The non-condensible gas mixture has a partial pressure equal to the desired saturation pressure of the condensible gas. The insulative housing also includes an immersion chamber for housing electronic components. The immersion chamber preferably comprises two retainer parts and provides an module retainer top and a lower coldplate retainer bottom. The module retainer top allows gas to pass through the module retainer portion freely. The condensible gas is then turned into liquid form by a provided condensing means. The condensed liquid thus forms and collects inside the immersion chamber against the coldplate retainer bottom to cool the electronic components placed within. The non-condensible gas permits the condensed liquid to be subcooled.

Abstract: Cooling module geometry provides a method for controlling local condensation for liquid impingement two-phase cooling of electrical and/or electronic circuit chips. The method and apparatus described herein uses vapor condensation in the exhaust flow from each chip site within a multi-chip module which utilizes direct liquid impingement with phase change.