Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
Type:
Grant
Filed:
November 22, 1991
Date of Patent:
February 2, 1993
Assignee:
SGS-Thomson Microelectronics, Inc.
Inventors:
Robert H. Bond, Michael A. Olla, Barry Morrison, Linn C. Garrison