Abstract: A hot melt adhesive for multipurpose bookbinding comprising a) from about 35% to about 40% by weight of a styrene-isoprene-styrene bloc copolymer; b) from about 25% to about 50% by weight of at least one compatible tackifying resin; c) from about 5% to about 30% by weight of a synthetic high melt point wax; d) from about 5% to about 30% by weight of a solid benzoate plasticizer; e) up to about 25% of a compatible wax; and f) up to about 15% of a compatible polymer.

Abstract: A hot melt useful for packaging, comprising from about 10% to about 30% by weight of at least one copolymer of ethylene and methyl acrylate (both acrylates and methacrylates); from about 10% to about 20% by weight of at least one copolymer of ethylene and n-butyl acrylate (both acrylates and methacrylates), wherein the total polymer content does not exceed 40% by weight, and the total ethylene n-butyl acrylate copolymer content does not exceed the total ethylene methyl acrylate copolymer content by percent weight in the adhesive; from about 20% to about 60% by weight of at least one tackifying resin selected from the group consisting of rosins and modified rosins and hydrogenated derivatives; aliphatic, cycloaliphatic and aromatic hydrocarbon resins and modified hydrocarbon resins and hydrogenated derivatives; terpenes and modified terpenes and hydrogenated derivatives; and mixtures thereof; from about 5% to about 30% by weight of at least one wax; and up to about 2% by weight of an antioxidant; wherein the r

Abstract: A hot melt adhesive composition comprising from about 5% to about 15% by weight of at least one radial styrene-isoprene-styrene block copolymer having the general configuration (pS--pI--pB).sub.n X wherein n is a number greater than 2, said block copolymer having a molecular weight from about 90,000 to about 380,000, and preferably from about 100,000 to about 250,000, and a styrene content from about 15% to about 35% by weight, and preferably from about 20% to about 30% by weight; up to about 10% of a compatible polymer, wherein the total polymer content does not exceed 15%; from about 30% to about 60% by weight of at least one compatible tackifying resin; from about 20% to about 40% by weight of at least one compatible plasticizer; and from about 0.1% to about 2% by weight stabilizer.

Abstract: This invention relates to a hot melt moisture cure polyurethane composition which is the reaction product of a) a polyether polyol formed from a compound selected from the group consisting of ethylene oxide, propylene oxide, 1,2-butylene oxide, 1,4-butylene oxide and mixtures thereof; b) a crystalline polyester polyol having a melting point from about 40.degree. C. to about 120.degree. C.; and c) and at least one polyfunctional isocyanate component.

Abstract: This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.

Abstract: A light weight, vibration-damping composition having effective amounts of at least one butyl rubber, at least one tackifying resin, at least one pigment and substantially spherical microspheres is disclosed. The present composition has a specific gravity of about 1.0 to 1.2 and has effective damping effects at low temperatures as well as temperatures up to about 60.degree. C. This composition is effective for use in the transportation industry, the building industry, the aerospace industry and the appliance industry.

Abstract: The present invention relates to a fast setting water sensitive polyamide composition which is the reaction product of at least one reactant which is a dicarboxylic acid, ester or anhydride thereof and at least one reactant is a diamine wherein at least one of said diamines is polyoxyalkylene diamine and at least one of said other reactants is aromatic and said polyamide composition has a T.sub.g of greater than about 15.degree. C. and a .DELTA.H greater than 0 Joules/gram.

Abstract: Hot-melt adhesive compositions useful for packaging are disclosed. These hot-melt adhesive compositions are based on modified polyethylene and contain a linear, low density copolymer or terpolymer of ethylene and another alpha-olefin, a polyethylene graft copolymer, a tackifying resin, and a high-melting low viscosity wax. The hot-melt adhesive compositions disclosed herein produce very good adhesive bonds, even at high speed packaging conditions under a broad range of ambient packaging temperatures. These inventive adhesive compositions have a novel combination of good hot tack and good adhesive bond properties, even at extreme conditions.

Abstract: A high heat resistant hot melt adhesive composition, its method of manufacture and its use on plastic and metallized foil containers, structures and the like is described herein, which adhesive contains a blend of an amorphous polyalphaolefin polymer, a solid benzoate plasticizer and a hydrocarbon tackifier where the elevated peel value of the resulting adhesive composition is greater than 160.degree. F.