Abstract: The present invention relates to a method for fabricating thin film transistors (TFTs), which includes the following steps: forming a semi-conductive layer on a substrate; forming a patterned photoresist layer with a first thickness and a second thickness on the semi-conductive layer; pattering the semi-conductive layer by using the patterned photoresist layer as a mask to form a patterned semi-conductive layer; removing the second thickness of the patterned photoresist layer; performing a first ion doping process on the patterned semi-conductive layer by using the first thickness of the patterned photoresist layer as a mask; removing the first thickness of the patterned photoresist layer; and forming a dielectric layer and a gate on the patterned semi-conductive layer. The present invention also discloses a method for fabricating an array substrate including aforementioned TFTs.

Abstract: The present invention relates to a driving device for a display and the method thereof for driving a pixel matrix containing N×M pixel units. The driving device for a display comprises: a first vertical driver generating N first vertical driving signals in sequence, each of N first vertical driving signals being used to drive the first through the K-th pixel units on each row of the pixel matrix; and a second vertical driver generating N second vertical driving signals in sequence, each of N second vertical driving signals being used to drive the (K+1)-th through the M-th pixel units on each row of the pixel matrix.

Abstract: A display device capable of detecting the light intensity of ambient light with high accuracy is disclosed. The display device has a backlight light source and a photo sensing unit. The display device also includes a voltage supply unit for providing a voltage, which makes the photo sensing unit output a certain amount of photocurrent to the photo sensing unit; and a supply voltage control unit for modulating the voltage supplied to the photo sensing unit based on the operation status of the backlight light source. The supply voltage control unit controls the voltage supply unit by the way of outputting a voltage of a first voltage to the photo sensing unit while the backlight light source is operating; and outputting a voltage of a second voltage, which is different from the first voltage, to the photo sensing unit while the backlight light source is not operating.

Abstract: Disclosed is a display device having a pixel electrode and a pixel driving transistor. The display device comprises a capacitor, a gate voltage control transistor and a source driving circuit. The capacitor, coupled to the gate of the pixel driving transistor, holds the applied voltage to the aforesaid gate. The gate voltage control transistor has a drain coupled to a connection point between the gate of the pixel driving transistor and the capacitor, a source coupled to the source bus line and a gate coupled to the gate line, for controlling the applied voltage of the capacitor. The source driving circuit utilizes the adjacent source bus lines to alternately switch the voltage held by the capacitor among several different high voltages and several different low voltages to drive the source.

Abstract: A display device includes a pixel electrode; a transistor for supplying a driving voltage to the electrode pixel; and a gate-line driver circuit for providing a gate voltage to the transistor and inversely driving a driving voltage supplied to the electrode pixel via the transistor. The gate voltage has different voltage levels in a first driving state that the gate-line driver circuit drives the transistor with a level of the driving voltage and in a second driving state that the gate-line driver circuit drives the transistor with another level of the driving voltage.

Abstract: The present invention is related to an asymmetric aligned display having asymmetric viewing angles. The present invention provides a dual-view or 3D display capable of displaying two images of unrelated or related content along different directions with asymmetric viewing angles. The asymmetric viewing angles of the display device of the present invention can be realized by the introduction of multiple sub-pixel pitches into a single display. To be more specific, the present invention provides an asymmetric aligned display by realizing the asymmetry design in the sub-pixel itself. Consequently, the angular extends of the respective viewing windows or images displayed along different directions can be different or asymmetrical. The asymmetric aligned display of the present invention is, therefore, capable of displaying images along different directions with asymmetric viewing angles and windows without affecting the outer boundaries of the viewing windows.

Abstract: A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.

Abstract: A photodiode device and methods of manufacturing the same are provided. The photodiode device comprises a light absorption layer defining a light-facing side and a back-light side; a via passing through the absorption layer, the via defining a side wall and a bottom surface; a conformal isolation layer covering the side wall and the bottom surface; a first patterned conductive layer disposed on the back-light side, the first patterned conductive layer having a first portion covering a first portion of the conformation isolation layer; a second patterned conductive layer disposed on the light-facing side of the absorption layer; and an opening through the conformal isolation layer, wherein the opening is filled with the second patterned conductive layer such that the second patterned conductive layer is connected with the first portion of the first patterned conductive layer.

Abstract: A method for manufacturing a cell is disclosed wherein sealing bodies (500, 600) are formed on a color filter mother substrate (102), and the color filter mother substrate (102) and a TFT mother substrate (202) are so assembled that the sealing bodies (500, 600) are interposed between the color filter mother substrate (102) and the TFT mother substrate (202). Seal making portions (501, 511; 503, 509; 505, 507) are deformed so that gap portions (G) are closed.

Abstract: A protective case for handheld devices with improved protection characteristics, durability, convenience of use, and functionalities without compromising aesthetics. The protective case includes a “glove” or “skin” piece of a softer material that substantially covers and grips the entire back of the electronic device, by wrapping over the edge of the electronic device (without obscuring the display/touch screen on the front of the device). One or more separate complementary frame pieces, braces and the like made of a hard material are attached over the glove piece, extending over a substantial area of the glove piece, thereby creating a robust interlocking hybrid structure. Openings are provided in the protective case to allow for user interaction with the device, including access to the interfaces (e.g., screens, buttons, sockets, etc.) provided on the device.

Abstract: A system for displaying images includes a multi-gate thin film transistor (TFT) device including an active layer, first and second gate structures, and first and second light-shielding layers. The active layer is disposed on a substrate in a pixel region. The first and second gate structures are disposed on the active layer. The first and second light-shielding layers are disposed between the substrate and the active layer. The active layer includes first and second source/drain regions and first and second channel regions. The first light-shielding layer corresponds to a first lightly doped region and laterally extends under at least a portion of the first channel region. The second light-shielding layer corresponds to the second lightly doped region and laterally extends under at least a portion of the second channel region.

Abstract: An embodiment of the invention provides a package structure for chip. The package structure for chip includes: a carrier substrate having an upper surface and an opposite lower surface; a chip overlying the carrier substrate and having a first surface and an opposite second surface facing the upper surface, wherein the chip includes a first electrode and a second electrode; a first conducting structure overlying the carrier substrate and electrically connecting the first electrode; a second conducting structure overlying the carrier substrate and electrically connecting the second electrode; a first through-hole penetrating the upper surface and the lower surface of the carrier substrate and disposed next to the chip without overlapping the chip; a first conducting layer overlying a sidewall of the first through-hole and electrically connecting the first conducting electrode; and a third conducting structure overlying the carrier substrate and electrically connecting the second conducting structure.

Abstract: A chip package is disclosed. The package includes a carrier substrate and at least two semiconductor chips thereon. Each semiconductor chip includes a plurality of conductive pads. A position structure is disposed on the carrier substrate to fix locations of the semiconductor chips at the carrier substrate. A fill material layer is formed on the carrier substrate, covers the semiconductor chips and the position structure, and has a plurality of openings correspondingly exposing the conductive pads. A redistribution layer (RDL) is disposed on the fill material layer and is connected to the conductive pads through the plurality of openings. A protective layer covers the fill material layer and the RDL. A plurality of conductive bumps is disposed on the protective layer and is electrically connected to the RDL. A fabrication method of the chip package is also disclosed.

Abstract: The invention discloses a horizontal electric field type liquid crystal display device having a plurality of pixels. Each pixel includes first and second electrodes disposed correspondingly on upper and lower surfaces of the substrate so as to change the orientation of liquid crystal molecules in the plane parallel to the substrate. Each pixel has a third electrode opposite the substrate. A liquid crystal layer containing liquid crystal molecules is sandwiched between the substrate and the third electrode. The first electrode and the third electrode can generate an electric field in the direction perpendicular to the substrate in the liquid crystal layer.

Abstract: A method for operating a memory device is provided. In accordance with the method, the charges are stored in a source storage region, a drain storage region, and a channel storage region of a charge storage layer which respectively correspond to a source, a drain, and a channel of a SONOS transistor, thereby achieving 3-bit information storage in one cell. The channel storage region is programmed and erased by FN tunneling. Both of the source storage region and the drain storage region are programmed by channel hot electrons and erased by source-side or drain-side FN tunneling. The present invention can store three-bit data per cell, such that the storage density of the memory device can be substantially increased.

Abstract: An embodiment of the invention provides a chip package, which includes a substrate having an upper surface and a lower surface, a chip disposed in or on the substrate, a pad disposed in or on the substrate and electrically connected to the chip, a hole extending from the lower surface toward the upper surface, exposing the pad, wherein a lower opening of the hole near the lower surface has a width that is shorter than that of an upper opening of the hole near the upper surface, an insulating layer located overlying a sidewall of the hole, and a conducting layer located overlying the insulating layer and electrically connected to the pad.

Abstract: The present invention relates to an active matrix display and an image display system using the active matrix display. The image display system includes the active matrix display and a power supply apparatus. The active matrix display includes an active matrix substrate, a reflective layer and a sidewall-protective structure. The reflective layer is formed above the active matrix substrate and has first and second surfaces. The second surface faces the active matrix substrate. The sidewall-protective structure is formed above the active matrix substrate and surrounds the sidewalls of the reflective layer adjacent to the first and second surfaces.

Abstract: A driving circuit of a flat panel display device includes a horizontal bus, a plurality of horizontal driver ICs, a vertical bus, and a plurality of vertical driver ICs. The horizontal driver IC is operative to decode N-types of vertical driving signals output from the horizontal bus, so as to transmit the N-type vertical driving signals to the corresponding vertical driver IC via a vertical signal line of the vertical bus.