Abstract: A multifunction modular electronic apparatus for performing information technology and telecommunications functions comprises a first module (101) for performing a plurality of first functions; a second module (102) having substantially the same physical dimensions as the first module for performing second functions; and a hinging mechanism (103, 104, 105) for enabling the two modules to be mechanically coupled, to rotate relative to each other over a full range of 360 degrees while remaining stably mechanically coupled in any intermediate position over the range, and to be fully separated from each other.

Abstract: An electret microphone (10) comprises an electret diaphragm (11) having a thin metallic layer (13) deposited on one of its major surfaces. A ring-shaped metal washer (20) bonded to the metallic layer (13) of the diaphragm (11) by means of a lightly metal-filled adhesive (21).

Abstract: A method for inserting a multilead component (30) into a printed wiring board (31) (PWB), wherein the component has its leads (32, 33) arranged in two or more rows and the PWB (31) has two or more rows of apertures (36, 37) arranged in a pattern corresponding to that of the leads of the component. The method comprises spreading the lead rows of the component (30) further apart than the aperture rows of the PWB (31); placing the component on the PWB (31) and applying a downward insertion force (41) thereon; vibrating the component (30) and the PWB (31) relative to each other; and moving the lead rows toward the aperture rows thereby inserting each lead in its corresponding aperture in the PWB.

Abstract: A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (.delta.) between a dispensing tool (20,25) and the board (23), the dispense pressure time cycle within the tool (FIG. 3A) and the tool velocity cycle (FIG. 3B). Also, an improved method for loading solder paste into the dispensing tool includes applying vacuum to two regions of the tool while vibrating it in its axial direction (FIG. 4). Furthermore, improved techniques for preventing crust formation on the paste within the tool, and for controlling the viscosity of the solder paste within the tool, achieve consistent dispensing results in a production environment.

Abstract: A technique for automatically identifying a semiconductor wafer (30) having bar code identification indicia (32) on the front surface (31) thereof. Reading of the code is achieved by rotating the wafer about an axis (34) perpendicular to its front surface (31); directing a beam of radiant energy (37) at the code (32) along a predetermined direction relative to the front surface (31); and sensing, while rotating the wafer, the reflected radiant energy (39) within a second predetermined angular direction relative to the front surface. The bar code used herein is preferably a modified or "stretched" bar code 39 formed on the front surface of the wafer, and having an aspect ratio (i.e., dimension of a space/dimension of a bar) ranging from 1 to 4 (FIG. 2).

Abstract: A hybrid integrated circuit (10), having a plurality of chip carriers (12) mounted thereon, is positioned on a nest (50) of an apparatus (30). An operator, while activating pneumatic switches (58), moves a selected one of the plurality of chip carriers (12) to an inspection site. A sensor plunger (62) detects the presence of the chip carrier (12) and enables a positioning assembly (34), which centers the chip carrier within the inspection site and locks the nest (50), to prevent further movement thereof. A viewing adaptor (70) is then lowered about the selected chip carrier (12) to enable the operator to simultaneously inspect all solder joints (22) positioned beneath the selected chip carrier. Thereafter, the operator releases switch actuator (60) which allows the viewing adaptor (70) to be raised and enables the positioning assembly (34) to unlock the nest (50) so that another chip carrier (12) may be moved to the inspection site for inspection by the operator.

Abstract: Printed circuit boards 10 having connector terminals 14 and 16 overlaying contact pads 17 and 18 are loaded into fixtures 22 which are conveyor 31 advanced through a pair of solder applying stations 33 and 34 whereat solder is laid and melted at the junctures of the terminals and contact pads. As a fixture approaches a solder applying station, the conveyor is slowed down and a programmed controller 170 is enabled for operation. If a circuit board is sensed by a photodetector 172, a second photodetector is rendered effective to sense elements 176 projecting from a side of the fixture. The sensed elements 176 effectuate the generation of count pulses and output signals to control the movements of solder applying devices 36 to soldering sites where solder feed devices 136 lay discontinuous stripes of solder at the junctures of the contact pads and terminals.

Abstract: An electrical component (10) is encased in a housing (31) and is provided with pairs of terminals (24-26) which permit surface mounting on a printed circuit (36, 37, 38) in a number of different orientations. The terminals are blanked from a metal strip (21) to form T-shaped terminals (24-26, 54-56 and 74-76) which are subsequently bent about the housing to form a number of sets of terminal pairs.

Abstract: A method and system are used for simultaneously programming a group of erasable programmable read only memories (EPROMs) (11) originally set in the "all-ones" state, by routing (17-49) programmed bytes, bit by bit, to each memory site on each EPROM and blocking (48) or bypassing the programming steps where a programmed byte consists of all ones, thus saving the programming time that would be normally used to program "all-ones" sites. Each programmed site and the sites set in the "all-ones" state are verified (52) prior to the routing of subsequent programmed bytes.

Abstract: An apparatus (10) for automatically feeding and measuring circular discs (12) includes a gauging station (15). The latter includes a pair of opposed capacitive displacement measuring probes (27 and 28). The probes are connected to a thickness measuring test set (66), adapted to provide a capacitance-derived measurement of the thickness of each advancing disc (12) at either one or a plurality of spaced measurement points (142) extending across the major surfaces thereof. Precise control must be maintained over the speed at which each disc is passed between the capacitive probes (27, 28) in a non-contacting manner. This is accomplished through the use of a controllably driven drive wheel (98), and a cooperative arcuate feed channel section (74), which includes an outer arcuate sidewall ramp insert (92).

Abstract: Apparatus for automatically selecting a semiconductor wafer out of a wafer cassette, and identifying the selected wafer. The apparatus (10) comprises means for accessing a selected individual semiconductor wafer (11) out of a plurality of wafers within a cassette (12), an arm (27) coupled to the accessing means for lifting the selected wafer partially out of the cassette, and a driving member (33) contacting the edge of the selected wafer and rotating the wafer to expose a predetermined portion thereof. An optical reader (37) is positioned proximate to the driving member for identifying information stored in the predetermined portion of the wafer (FIG. 1).

Abstract: Parts (10) to receive a thin strip of solder are advanced along top surfaces of a pair of upwardly inclined channel plates (26, 27). Pressurized solder (31) is pumped between the plates to a precise head which projects as a meniscus (28) above the top surfaces of the channel members and is deposited on the advancing parts. The head of solder is maintained at a height to insure a partial flow of solder through a V-shaped trough (51). Any fluctuations in the height of head of solder is rapidly compensated by an increased or decreased flow of solder through the trough. A significant reservoir of solder is maintained between the channel plates so that the solder is held at a substantially constant temperature.

Abstract: A semiconductor wafer pickup device (26) making use of vacuum and Bernoulli effect in order to hold the wafer (11) against the device and to minimize wafer contamination. The wafer pickup device comprises a centrally located Bernoulli orifice (32) and a plurality of peripherally located small tubular legs (38,39,40). In a first stage of a pickup operation, air is blown out of the Bernoulli orifice and out of the tubular legs. Next, vacuum is applied to the tubular legs while pressurized air is still blown out of the Bernoulli orifice. The combination of the Bernoulli effect with the suction at the vacuum legs locates the wafer in a position where the legs hold onto it. Then, the pressurized air is turned off thus leaving the wafer held only by the vacuum legs (FIGS. 2A, 2B).

Abstract: Capacitor blanks (10) are gravity advanced down an inclined chute (22) into engagement with a flipper vane (36) whereat one (18) of a pair of oppositely disposed test probes (18) and (19) is advanced to engage and push the capacitor blank into engagement with the other probe. If the capacitor blank is not engaged by the test probes so that a predetermined minimum capacitance reading is attained by a test set (29), the test probe (18) is withdrawn and a signal generated to control the operation of the flipper vane (36) which functions to thrust the capacitor back up the chute. Upon proper positioning of the capacitor and completion of a test, the flipper vane is again operated in such a fashion that the tested capacitor passes to a sorting device (61, 64, and 65) which directs the capacitor blank into either an accept recepticle (62) or reject recepticle (63).

Abstract: A hand (10) capable of simultaneously handling a plurality of articles (11) comprising a pickup head (15) having a plurality of vacuum pickup cavities (18), each cavity substantially matching the size and shape of the article to be handled. In one embodiment, the pickup head comprises a seal (26) positioned around an article-matching cavity (18) thereof and an opening (19) therethrough for communicating the cavity (18) with a vacuum chamber (20). In another embodiment, the pickup head comprises, positioned within its opening, a bellows (48) having a cylindrical sleeve (51) at one end and a planar flange (49) coupled to the vacuum chamber (20) by means of a seal (52) at its other end.

Abstract: Sheets 12 are fed one at a time from a stack 11 by a freely mounted roller 13 magnetically coupled to a rotating drive roller 14. As the stack is depleted, an elevator 27 is operated to maintain the top sheet in contact with the roller 13.

Abstract: Leads (22) of an electrical component (20) are positioned within and extend through a plurality of apertures (74) formed through a substrate (54). The substrate (54) includes a circuit (56) formed on one major surface thereof and a plurality of contacts (76) mounted thereon which is electrically connected to the circuit (56) and which overlaps a portion of the appropriate one of the plurality of apertures (74) formed therethrough. A lead pusher (32) moves the leads (22) into engagement with the contacts (76). Thereafter, free ends of the leads (22) are moved beyond a point of engagement between the leads and the contacts (76) so that the lead is flexed to insure a firm engagement between the leads and the contacts.

Abstract: A base housing unit (32), which supports a connector (48) on a bottom wall (40) thereof, includes a vertical boss (46) spaced from the connector to provide a cable receiving recess (70). An elongated slot (42) is formed through the vertical boss (46). A first end section of a flat cable (10), having accordion pleat sections (64, 66 and 68) formed therein, is threaded through the elongated slot (42). The pleat sections (64, 66 and 68) are positioned within the recess (70) and the first end section of the cable (10) is terminated on the connector (48). A cover (50) is then secured to the base housing unit (32). In response to the application of tension to a free end of the cable (10), the pleat sections (64, 66 and 68) flex to bind the cable between the connector (48) and the cover (50).

Abstract: Parts (10) with terminals (17) wrapped with insulation coated wire (20) are loaded into quick clamp and release fixtures (24) and then advanced by a conveyor (26) through a flux applying station (42) and then through an insulation removing and solder depositing station (46). Solder is pumped through a well (47) and divided into two oppositely flowing sets of streams capped by open top housings (66, 67 and 68). The hot solder flowing counter to the direction of movement of the terminals acts to melt and wash away the insulation whereafter the solder flowing in the direction of movement of the terminals acts to deposit solder on the wire wrapped terminals.

Abstract: A thru-hole insertable terminal (10, 50, 60) includes an upper shank portion (12, 52, 66) preferably adapted for soldered securement to an end electrode (24) of a component (20), such as a capacitor. A lower shank portion (14, 54, 68) is dimensioned and adapted for minimal initial contact insertion into, and the temporary securement thereafter within, an oversized thru-hole (26, 58, 62) of a supporting substrate, such as a circuit board (28, 59, 64). At least one upwardly extending free-ended tab (32, 56, 72, 74) is formed in the lower terminal shank portion (14, 54, 68), and is oriented in the major plane thereof until after the insertion thereof within an associated substrate-formed thru-hole (26, 58, 62). Stop means (14b, 14c, 54b, 54c, 68b, 68c) also formed in the lower terminal shank portion is adapted to position the upper free end of the tab at an elevation preferably below the upper open end of a confining thru-hole.