Abstract: A projection system wherein two or more separate display sources, such as high brightness sources, or active matrix liquid crystal display (AMLCD) or other flat panel displays are used to write information directly onto a display screen, or onto a photoactivated reflective light valve for projection onto the display screen. Sequential imaging apparatus is used to alternately generate first and second images for display. For example, such images are coupled to the photoactivated reflective light valve and an illumination source is employed to illuminate the light valve and project a composite image onto the display screen. The flat panel displays may be transmissive, reflective, or self-emissive with the use of an optical shutter. A writing illumination source is used for non-self-emissive flat panel displays. Using high brightness display sources, the images may be directly written onto the display screen without the use of the reflective photoactivated light valve and the illumination source.

Abstract: A layer of sacrificial, chemically reactive material is formed as part of the fabrication process of an integrated circuit, and covers active circuitry to protect it from reaction with hydrogen. Integrated circuits and fabrication methods are provided by the present invention. The present invention is used to fabricate integrated circuits such as ferroelectric memories, and the like, using die or substrates containing one or more sacrificial layers of strontium bismuth niobate tantalate, for example. The sacrificial layers consume atmospheric hydrogen or other materials that otherwise would react with active circuitry of the integrated circuits and render them ineffective.

Abstract: A portable integrated circuit die testing system that offers a cost-effective solution for electrically testing bare, unpackaged, integrated circuit chips or die. The system provides for direct electrical interconnection of die of various sizes and thicknesses to an automatic tester without wire bonding or packaging of the semiconductor chip or die. The system includes an X-Y table that is adjustable in horizontal X and Y directions. A contact platform is disposed above the X-Y table that has an opening therein, and is movable in a vertical direction relative to the X-Y table. An adjustment member is coupled to the contact platform for finely adjusting the movement thereof in the vertical direction. A die holder is secured to the X-Y table for holding the die that is to be tested, and in response to movement of the X-Y table. A vacuum connection is provided for drawing a vacuum on the tested die to secure it in the die holder.

Abstract: Metal organic acid salt solutions for use as precursor materials for forming layered ferroelectric thin films are synthesized using an organic acid anhydride as the exchange reagent. The reaction is much faster than previous techniques, allows exact control of exchange with control of hydrolysis product, and may be used to control the solvent of the final solution. The reaction creates no water, and can be used to exactly control the extent of reaction of all metals. By using less than or equal to a stoichiometric amount of anhydride and then further reacting the remaining alkoxides, lower carbon content solutions with less decomposable organic can be formed. As such, the present invention discloses a much improved and faster synthesis technique giving improved solutions and corresponding thin film metal oxide compositions with improved and consistent electrical performance.

Abstract: A glass-ceramic substrate for encapsulating an electronic component, with at least two shrinkage control layers restricting shrinkage of the substrate during a co-firing process. The shrinkage control layers are chosen so that they have substantially the same shrinkage characteristics, during co-firing, as the buried electronic component. This results in substantially no differential shrinkage between the electronic component and the substrate, along predetermined directions, during co-firing. In addition, the thermal expansion coefficients of the substrate, shrinkage control layers and electronic component are chosen so that they substantially match, such that their thermal-induced contraction during the cooling phase of the co-firing process substantially match. In the preferred embodiment, the electronic component is buried within the layers of an LTCC structure. The shrinkage control layers are preferably implemented as Al.sub.2 O.sub.3 or TiO.sub.

Abstract: A high power, flip-chip microwave monolithic integrated circuit (MMIC) assembly (30) has a high power microwave monolithic integrated circuit (MMIC) having a surface with an active area (72) in which heat is generated. The assembly also has a host substrate (34). A thermally conductive bump (51) formed over the surface of the MMIC has a first portion (51') in close proximity to and in thermal communication with the active area (72) of the MMIC and a second portion (51") which is in close proximity to and in thermal communication with the host substrate (34). The second portion (51") of the thermal bump (51) has a greater cross-sectional area than the first portion (51'). A multi-layer, multi-exposure method of manufacturing the improved thermal bump (51) includes several steps. A plating membrane (80) is formed on a surface of the MMIC (32). A first layer of negative photoresist is applied to the surface of the plating membrane (80), and is exposed with a first masked pattern of light.

Abstract: A unique photoresist process is provided which achieves clean and complete lift-off of a thin film layer such as a sputtered thin film formed on a photoresist which is formed above a semiconductor substrate. The process of the present invention relies on a reentrant photoresist profile which breaks the continuity of the thin film layer. Accordingly, the process of the present invention ensures a clean lift-off. The desired photoresist profile which breaks the continuity of the thin film layer can be obtained by a typical photoresist process preceded by an oxidation process that takes place on the surface of the semiconductor substrate. The oxidation process provides a thin native oxide layer with thickness ranging from about 30 to 50 .ANG.. No extra processing steps involving dielectric film deposition and etch are required to achieve clean lift-off. Nevertheless, the process of the present invention ensures the clean lift-off of the thin film layer.

Abstract: A rotary connector comprising first and second printed wiring boards that rotate relative to each other and that are electrically interconnected using spring loaded pogo-stick type contacts. The spring-loaded contacts are used to transfer electrical signals or power to metallized rings or contacts formed on the first printed wiring board. The spring-loaded pogo-stick type contacts are very rugged and provide for a rotary connector having long life.

Abstract: Single crystal sapphire is conventionally employed for mid-wave IR windows and domes exposed to high aerodynamic heating environments. Single crystal sapphire, however, suffers a loss of compressive strength in the c-axis of 95% on heating from ambient to 800.degree. C. This loss of compressive strength on heating results in poor thermal shock resistance. Poor thermal shock resistance jeopardizes the reliability of the windows and domes. The process of the present invention strengthens sapphire and improves its resistance to thermal shock by introducing magnesium (Mg) ions into the crystal lattice of sapphire to form a solid solution. The solid solution increases the strength of the sapphire. Additionally, a larger increase in strength results from converting the Mg into second phase precipitates comprising magnesium aluminate spinel.

Abstract: Multiple solid precursor bubblers are used to alleviate channeling effects caused by high carrying gas flow rates to provide for deposition of indium-based epitaxial materials in high-capacity MOCVD reactor systems. Precracking of precursor materials that exhibit higher dissociation temperatures using heated manifolds or heated susceptor, and rotation of individual wafers in a multi-wafer reactor chamber enhance thickness uniformity, surface morphology and electronic properties of deposited epitaxial layers.

Abstract: Surface preparation methods and materials that provide corrosion protection for aluminum and its alloys without the use of chromate and that protects aluminum surfaces against corrosion nearly as well as a chromate conversion coating. In accordance with the present methods, aluminum parts are degreased in a general purpose cleaner and rinsed in hot tap water. The parts are then cleaned using alkaline cleaner and then rinsed in cold tap water. The parts are then deoxidized using one of two alternative steps. The parts may be deoxidized using a 20-25 volume percent Smut-Go NC solution at room temperature for 15-25 minutes. The parts may alternatively be deoxidized using a solution of 10% HNO.sub.3 and 3% NaBrO.sub.4 dissolved in water at room temperature for 15-25 minutes. The deoxidized aluminum parts are then rinsed in cold tap water. The parts are then immersed in boiling deionized water and then sealed using a 1% LiNO.sub.3, 10% Al(NO.sub.3).sub.3 and 10% aluminum silicate solution.

Abstract: Spring loaded rotary connectors that comprise a first wiring board having one or more sets of electrically conductive concentric circuits or rings formed thereon, that has one or more raised contacts, or looped-shaped dimples, for every ring. In a first embodiment, the first wiring board faces a second wiring board having electrically conductive concentric rings or circuits that form contacts. The first wiring board is coupled to a moving (rotating) component while the second wiring board is coupled to a stationary component, or vice-versa. The sliding rings and dimples (contacts) on the adjacent wiring boards permit signals and power to be transferred from the moving part of the connector to the stationary part thereof.

Abstract: Methods of forming two-sided high density multilayer interconnect (HDMI) structures on a relatively large carrier and subsequently releasing and removing one or more structures to provide useable flexible interconnects or decals. In general, a carrier is provided and a release layer is formed on the carrier. Flexible high density multilayer interconnect structures are fabricated on the release layer. The release layer is processed to release and remove one or more flexible HDMI structures from the carrier. The carrier may be an ultraviolet transparent substrate, such as quartz, for example, and the release layer may be a polyimide layer. The HDMI structures are released by irradiating the release layer through the transparent carrier using ultraviolet radiation from an ultraviolet radiation source. Alternatively, a silicon carrier may be used that has a metal or silicon dioxide release layer formed thereon.

Abstract: A method of fabricating self-aligned static induction transistors is disclosed. The method comprises fabricating a silicon substrate having an active area. A guard ring is formed around the active area. Source and gate regions are formed, and a self-aligned relatively deep trench in accordance with the present invention is formed over the gate regions. This is achieved by forming an oxide layer, and forming a polysilicon layer on the oxide layer. A second oxide layer is formed on the polysilicon layer which is then masked by a self-aligning mask. Trenches are etched into the source and gate regions using the self-aligning mask and gate regions are formed at the bottom of the trenches. The transistors are then processed to completion by forming gate, source and drain regions.

Abstract: Processing methods and apparatus that process magnetometer data derived from an array of magnetometer sensors and outputs both the position and velocity of a magnetic dipole. In the method and apparatus, (a) a set of actual magnetic field measurements of a magnetic dipole is collected using the array of magnetic sensors. Then (b), a trajectory for the magnetic dipole is hypothesized. Then (c), a set of estimated magnetic field measurements is determined that would be formed by a magnetic dipole moving along the hypothesized trajectory. Then (d), the actual magnetic field measurements are compared with the estimated magnetic field measurements. Then (e), based on the comparison, a new trajectory for the magnetic dipole is hypothesized. Steps (c) through (e) are repeated until agreement between the actual magnetic field measurements and the estimated magnetic field measurements is deemed sufficiently close. The trajectory is displayed for viewing on a display.

Abstract: A liquid carbon dioxide dry cleaning system that employs a rotating basket inside a dry cleaning vessel that is powered by hydraulic flow. The present invention is particularly useful as a dry cleaning system that uses liquid carbon dioxide as the cleaning agent. The dry cleaning system has a pressurized vessel containing a liquid carbon dioxide bath. The basket is disposed in the vessel and has a plurality of openings around its periphery. A plurality of roller bearings are disposed between the basket and the vessel that allow it to rotate within the vessel. A plurality of manifolds are disposed between the vessel and the basket that have nozzles that produce jets of liquid carbon dioxide that agitate the garments. The nozzles are aligned with the plurality of openings in the basket. A pump is coupled between the manifolds and the vessel for circulating the liquid carbon dioxide to produce the jets that clean the garments and rotate the basket.

Abstract: Bonding of expanded polymeric parts together to produce lost foam molds suitable for casting metallic details is accomplished by applying a non-aqueous, adhesive-free coating comprising a polar, highly dielectric component contained in a liquid vehicle to the interfacing surface of at least one of the parts to be joined. The interfacing surfaces of the parts to be joined are held in contact while the assembly is irradiated with high frequency electromagnetic energy. This energy enables the coating to dielectrically heat the mated expanded polymeric parts until a bond is effected by melting the polymeric parts and inducing expansion of the parts into one another.

Abstract: A method of operating a liquid crystal display, and a liquid crystal display constructed to operate in accordance with the method. The liquid crystal display has a plurality of display pixels, and the method comprises the steps of (a) operating a first switch (S1) for storing a charge on a storage capacitance (C1), the charge having a magnitude selected so as to cause a desired degree of polarization of a region (pixel) of liquid crystal material; (b) operating a second switch (S2) so as to conductively couple the stored charge to the region of liquid crystal material, thereby storing a charge on a capacitance (C2) that is associated with the region of liquid crystal material; and (c) operating a third switch (S3) so as to discharge the storage capacitance and the capacitance that is associated with the region of liquid crystal material.

Abstract: An improved method for soldering a thermoelectric cooler between an electronic device and a heatsink. Thermoelectric coolers are assembled by soldering parts together using a first solder. The bottom surface of the thermoelectric cooler is first soldered to the heatsink using a second solder and then the top surface is soldered to the electronic device using a third solder preferably having the same melting point as the second solder, or having approximately the same melting point as the second solder. Reverse powering of the thermoelectric cooler assists the soldering of the top surface to the electronic device by heating the top surface to a temperature sufficient to melt the third solder while cooling the bottom surface of the thermoelectric cooler to a temperature lower than the melting point of the second solder.

Abstract: The present invention provides a method and apparatus for metallizing vias in co-fired ceramic green tape. A vacuum operated pick and place anvil comprising a porous block is used to pick up conductor balls from a bed. Air pressure is used to create a vacuum which pulls the conductor balls to the porous block. A stencil having openings is placed on a contact surface of the anvil, thereby permitting only one conductor ball to attach to each opening in the stencil. With the conductor balls attached to the anvil, the anvil is lowered onto the green tape. Next the anvil pushes the conductor balls into the tape until the conductor balls break through the opposite side of the tape. The anvil is retracted leaving the conductor balls lodged in the tape. It is possible to provide a green tape with pre-formed vias so that forcing the conductor balls into the tape is a simpler task.