Abstract: An improved circuit board having a variety of electronic components mounted thereon and having disposed to the autumn side of the circuit board a backing plate having a variety of thicknesses wherein a thicker portion of the backing plate is disposed near portions of the circuit board or components on the circuit board which are of a higher heat generating nature, the circuit board further having a slot extending through the circuit board and inserted in the slot is a metallic shielding cover which contacts the backing plate. Also disclosed is a method for manufacturing the circuit board.
Type:
Grant
Filed:
September 19, 1990
Date of Patent:
March 22, 1994
Assignee:
Rockwell International Corporation
Inventors:
Charles C. Deyo, Thomas R. Wolters, Robert H. Oas